Abstract: A metrology apparatus for determining one or more parameters of a structure fabricated in or on a semiconductor substrate. The apparatus comprises a transducer array comprising a plurality of transducers positioned in a plane. The plurality of transducers comprises at least one transmitter transducer for emitting acoustic radiation in a frequency range from 1 GHz to 100 GHz towards the structure, and at least one receiver transducer for receiving acoustic radiation reflected and/or diffracted from the structure.

Abstract: The present document relates to a method of monitoring an overlay or alignment between a first and second layer of a semiconductor using a scanning probe microscopy system. The method comprises scanning the substrate surface using a probe tip for obtaining a measurement of a topography of the first and second layer in at least one scanning direction. At least one pattern template is generated which is matched with the topography of the first layer for determining a first candidate pattern. The first candidate pattern is matched with the measured second topography for obtaining a second candidate pattern to represent the measured topography of the second layer. Feature characteristics of device features are determined from both the first and second candidate pattern, and these are used to calculate one or more overlay parameters or alignment parameters.

Abstract: The present document relates to a heterodyne scanning probe microscopy (SPM) method for subsurface imaging, and includes: applying an acoustic input signal to a sample and sensing an acoustic output signal using a probe. The acoustic input signal comprises a plurality of signal components at unique frequencies, including a carrier frequency and at least two excitation frequencies. The carrier frequency and the excitation frequencies form a group of frequencies, which are distributed with an equal difference frequency between each two subsequent frequencies of the group. The difference frequency is below a sensitivity threshold frequency of the cantilever for enabling sensing of the acoustic output signal. The document also describes an SPM system.

Abstract: The photonic integrated device comprises a substrate, a plurality of mechanical resonator structures on a surface of the substrate, exposed to receive sound waves from outside the device; a plurality of sensing optical waveguides, each sensing optical waveguide at least partly mechanically coupled to at least one of the mechanical resonator structures, or a sensing optical waveguide that is at least partly mechanically coupled to all of the mechanical resonator structures; an input optical waveguide on the surface of the substrate, coupled to the plurality of sensing optical waveguides or the single sensing optical waveguide, for supplying light to the plurality of sensing optical waveguides or the single sensing optical waveguide; at least one output optical waveguide on the surface of the substrate, coupled to the plurality of sensing optical waveguides or the single sensing optical waveguide, for collecting light from the plurality of sensing optical waveguides or the single sensing optical waveguide that

Abstract: The photonic integrated device for converting a light signal into sound comprises-a substrate having a substrate surface, an optical waveguide on the substrate surface, a photo-acoustic conversion body, comprising at least one volume of fractionally light absorbing material or formed entirely of fractionally light absorbing material, wherein a width of the photo-acoustic conversion body is greater than a width of the optical waveguide and means for enhancing distribution of light from the optical waveguide over the photo-acoustic conversion body.

Abstract: The photo-acoustic conversion based sound emitter device has a sound output surface for transmitting sound wave vibrations to a medium outside the device. An optical waveguide, is used to transmit light through an optical path within the device. First and second photo-acoustic conversion volumes, at different distances from the sound output surface, are used for transmitting sound generated in the first and second volume to the medium via the sound output surface, the optical path extending directly or indirectly successively through the first and second photo-acoustic conversion volume.

Abstract: The sound detection device comprises a substrate, an array of sound detectors in or on a surface of the substrate, a processing circuit coupled to the sound detectors, the processing circuit being configured to sum signals from the sound detectors with relative time delays or phase shifts that compensate for propagation delay of sound along the array in a sound propagation mode that is bound to said surface. In an embodiment the sound in said sound propagation mode is bound to the surface using an acoustic waveguide, wherein the surface of the substrate forms a part of the acoustic waveguide, the sound detection device comprising a wall facing the array of sound detectors, with a space between the surface of the substrate and the wall, the sound detection device comprising an opening that provides incoming sound from outside the device access to said space, for excitation of the wave in the bound propagation mode in the acoustic waveguide by sound from outside the device.

Abstract: The present document relates to a heterodyne scanning probe microscopy (SPM) method for subsurface imaging, and includes: applying an acoustic input signal to a sample and sensing an acoustic output signal using a probe. The acoustic input signal comprises a plurality of signal components at unique frequencies, including a carrier frequency and at least two excitation frequencies. The carrier frequency and the excitation frequencies form a group of frequencies, which are distributed with an equal difference frequency between each two subsequent frequencies of the group. The difference frequency is below a sensitivity threshold frequency of the cantilever for enabling sensing of the acoustic output signal. The document also describes an SPM system.

Abstract: The present document relates to a heterodyne scanning probe microscopy (SPM) method for subsurface imaging, and includes: applying, using a transducer, an acoustic input signal to the sample, wherein the acoustic input signal has a frequency of at least 1 gigahertz; sensing an acoustic output signal using a probe, the probe including a cantilever and a probe tip, wherein the probe tip is in contact with the surface, wherein the acoustic output signal is representative of acoustic waves responsive to the acoustic input signal that are measurable at the surface; wherein the acoustic input signal is applied to the sample comprising a distinct pulse of acoustic energy followed by a relaxation period, wherein an acoustic power of the acoustic input signal during the pulse is at least twice as large as an acoustic power during the relaxation period. The present document further relates to a scanning probe microscopy method.

Abstract: Methods and systems for subsurface imaging of nanostructures buried inside a plate shaped substrate are provided. An ultrasonic generator at a side face of the substrate is used to couple ultrasound waves (W) into an interior of the substrate. The interior has or forms a waveguide for propagating the ultrasound waves (W) in a direction (X) along a length of the substrate transverse to the side face. The nanostructures are imaged using an AFM tip to measure an effect (E) at the top surface caused by direct or indirect interaction of the ultrasound waves (W) with the buried nanostructures.

Abstract: The document relates to a method of performing subsurface imaging of embedded structures underneath a substrate surface, using an atomic force microscopy system. The system comprises a probe with a probe tip, and a sensor for sensing a position of the probe tip. The method comprises the steps of: positioning the probe tip relative to the substrate: applying a first acoustic input signal to the substrate; applying a second acoustic input signal to the substrate; detecting an output signal from the substrate in response to the first and second acoustic input signal; and analyzing the output signal. The first acoustic input signal comprises a first signal component and a second signal component, the first signal component comprising a frequency below 250 megahertz and the second signal component either including a frequency below 2.5 megahertz or a frequency such as to provide a difference frequency of at most 2.

Abstract: Methods and systems for measuring a fluid flow comprise a plurality of transceivers disposed at predetermined locations distributed along a perimeter around the fluid flow. The transceivers transmit and receive acoustic signals through the fluid flow there between. A plurality of different acoustic paths through the fluid flow are formed between different transceiver pairs. Different time intervals are measured between respective times of transmitting and receiving the acoustic signals; and along the plurality of different acoustic paths. A velocity map of the fluid flow is calculated by fitting the measured different time intervals to a model of the fluid flow. The model of the fluid flow defines a velocity map with different flow velocities in a cross-section plane transverse to the fluid flow.

Abstract: A nondestructive method of monitoring scale buildup in a section of pipe includes: transmitting, from a first transducer at a first location of the pipe, axisymmetric torsional ultrasonic guided waves (UGWs) to propagate along the pipe, the torsional UGWs spanning a frequency band comprising multiple higher order modes; receiving, by a second transducer at a second location of the pipe, the propagated torsional UGWs; and determining a thickness of the scale buildup in the pipe between the first location and the second locations using the received torsional UGWs. The determining step comprises: measuring attributes from the received torsional UGWs, the attributes being first arrival times or mode cutoff frequencies; comparing the measured attributes to sets of computed said attributes, each set representing a different scale buildup thickness; and selecting the compared set of computed attributes that is closest to the measured attributes.

Abstract: Atomic force microscopy system comprising an atomic force microscopy device and a substrate carrier having a carrier surface carrying a substrate. The substrate has a substrate main surface and a substrate scanning surface opposite the substrate main surface. The atomic force microscopy device comprises a scan head including a probe. The probe comprises a cantilever and a probe tip arranged on the cantilever. The atomic force device further comprises an actuator cooperating with at least one of the scan head or the substrate carrier for moving the probe tip and the substrate carrier relative to each other in one or more directions parallel to the carrier surface for scanning of the substrate scanning surface with the probe tip. A signal application actuator applies, during said scanning, an acoustic input signal to the substrate, said acoustic input signal generating a first displacement field in a first displacement direction only.

Abstract: Methods and systems for subsurface imaging of nanostructures buried inside a plate shaped substrate are provided. An ultrasonic generator at a side face of the substrate is used to couple ultrasound waves (W) into an interior of the substrate. The interior has or forms a waveguide for propagating the ultrasound waves (W) in a direction (X) along a length of the substrate transverse to the side face. The nanostructures are imaged using an AFM tip to measure an effect (E) at the top surface caused by direct or indirect interaction of the ultrasound waves (W) with the buried nanostructures.

Abstract: Atomic force microscopy system comprising an atomic force microscopy device and a substrate carrier having a carrier surface carrying a substrate. The substrate has a substrate main surface and a substrate scanning surface opposite the substrate main surface. The atomic force microscopy device comprises a scan head including a probe. The probe comprises a cantilever and a probe tip arranged on the cantilever. The atomic force device further comprises an actuator cooperating with at least one of the scan head or the substrate carrier for moving the probe tip and the substrate carrier relative to each other in one or more directions parallel to the carrier surface for scanning of the substrate scanning surface with the probe tip. A signal application actuator applies, during said scanning, an acoustic input signal to the substrate, said acoustic input signal generating a first displacement field in a first displacement direction only.

Abstract: Methods and systems for measuring a fluid flow comprise a plurality of transceivers disposed at predetermined locations distributed along a perimeter around the fluid flow. The transceivers transmit and receive acoustic signals through the fluid flow there between. A plurality of different acoustic paths through the fluid flow are formed between different transceiver pairs. Different time intervals are measured between respective times of transmitting and receiving the acoustic signals; and along the plurality of different acoustic paths. A velocity map of the fluid flow is calculated by fitting the measured different time intervals to a model of the fluid flow. The model of the fluid flow defines a velocity map with different flow velocities in a cross-section plane transverse to the fluid flow.

Abstract: The present invention relates to a method of performing subsurface imaging of embedded structures in a substrate underneath a substrate surface, the method comprising the steps of applying, using a signal application actuator, an acoustic input signal to the substrate, detecting, using a vibration sensor, a return signal from the substrate and analyzing the return signal for obtaining information on the embedded structures, for enabling imaging thereof wherein the step of applying the acoustic input signal comprises applying a discontinuous signal of an acoustic signal component to the substrate, the acoustic signal component having a frequency above 1 gigahertz, such that the return signal includes a scattered fraction of the discontinuous signal scattered from the embedded structures. The invention further relates to a system.

Abstract: The document relates to a method of performing subsurface imaging of embedded structures underneath a substrate surface, using an atomic force microscopy system. The system comprises a probe with a probe tip, and a sensor for sensing a position of the probe tip. The method comprises the steps of: positioning the probe tip relative to the substrate: applying a first acoustic input signal to the substrate; applying a second acoustic input signal to the substrate; detecting an output signal from the substrate in response to the first and second acoustic input signal; and analyzing the output signal. The first acoustic input signal comprises a first signal component and a second signal component, the first signal component comprising a frequency below 250 megahertz and the second signal component either including a frequency below 2.5 megahertz or a frequency such as to provide a difference frequency of at most 2.