Patents by Inventor Danielle Grolman

Danielle Grolman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-FUNCTIONAL INTERFACE/SURFACE LAYER FOR THERMOPLASTIC COMPONENTS
    Publication number: 20240351295
    Abstract: A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
    Type: Application
    Filed: April 25, 2024
    Publication date: October 24, 2024
    Applicant: Raytheon Company
    Inventors: Wenping Zhao, Lei Xing, Danielle Grolman, Orlando Mijares, Mary K. Herndon, Sridhar Siddhamalli
  • Multi-functional interface/surface layer for thermoplastic components
    Patent number: 11993026
    Abstract: A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: May 28, 2024
    Assignee: Raytheon Company
    Inventors: Wenping Zhao, Lei Xing, Danielle Grolman, Orlando Mijares, Mary K. Herndon, Sridhar Siddhamalli
  • MULTI-FUNCTIONAL INTERFACE/SURFACE LAYER FOR THERMOPLASTIC COMPONENTS
    Publication number: 20220250334
    Abstract: A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
    Type: Application
    Filed: February 10, 2021
    Publication date: August 11, 2022
    Applicant: Raytheon Company
    Inventors: Wenping Zhao, Lei Xing, Danielle Grolman, Orlando Mijares, Mary K. Herndon, Sridhar Siddhamalli