Patents by Inventor Daniil Zykov

Daniil Zykov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11863087
    Abstract: A stacked structure is composed of a plurality of layers, and includes: a substrate; a plurality of conductive patterns printed on the substrate; and at least one layer of elastic nodules formed between two layers of the plurality of layers, the layer of elastic nodules including a sensing area being used for at least one of actuation or sensing. The stacked structure is formed by folding the substrate multiple times. The stacked structure further includes: an adhesive layer printed on but not completely covering the conductive patterns and substrate, and forming at least one air reservoir for holding air displaced when the sensing area is compressed. The stacked structure does not include electrically conducting through holes or electrically connecting structures.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: January 2, 2024
    Assignee: PixArt Imaging Inc.
    Inventors: Ville Topias Makinen, Roberto Tejera-Garcia, Daniil Zykov
  • Publication number: 20220181994
    Abstract: A stacked structure is composed of a plurality of layers, and includes: a substrate; a plurality of conductive patterns printed on the substrate; and at least one layer of elastic nodules formed between two layers of the plurality of layers, the layer of elastic nodules including a sensing area being used for at least one of actuation or sensing. The stacked structure is formed by folding the substrate multiple times. The stacked structure further includes: an adhesive layer printed on but not completely covering the conductive patterns and substrate, and forming at least one air reservoir for holding air displaced when the sensing area is compressed. The stacked structure does not include electrically conducting through holes or electrically connecting structures.
    Type: Application
    Filed: January 12, 2022
    Publication date: June 9, 2022
    Applicant: PixArt Imaging Inc.
    Inventors: Ville Topias Makinen, Roberto Tejera-Garcia, Daniil Zykov