Abstract: A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of the ink; and assembling the silicon substrate with the hydraulic structure layer and the silicon orifice plate. Providing the silicon orifice plate includes: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.

Abstract: A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; and assembling the silicon substrate with said hydraulic structure layer and said silicon orifice plate. Providing the silicon orifice plate comprises: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning step at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.

Abstract: A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; and assembling the silicon substrate with said hydraulic structure layer and said silicon orifice plate. Providing the silicon orifice plate comprises: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning step at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.

Abstract: A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; and assembling the silicon substrate with said hydraulic structure layer and said silicon orifice plate. Providing the silicon orifice plate comprises: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning step at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.

Abstract: A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; and assembling the silicon substrate with said hydraulic structure layer and said silicon orifice plate. Providing the silicon orifice plate comprises: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning step at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.

Abstract: A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; and assembling the silicon substrate with said hydraulic structure layer and said silicon orifice plate. Providing the silicon orifice plate comprises: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning step at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.

Abstract: A method of manufacturing an ink jet printhead, including: arranging a nozzle plate in which there is formed a plurality of nozzles, the nozzle plate having an upper surface and a lower surface, the upper surface being on the side of the ejection of ink drops and the lower surface being opposite to the upper surface; depositing on the upper surface a first coating including a first layer including silicon carbide, while maintaining the nozzle plate at a first deposition temperature not larger than 250° C.; depositing on the lower surface a second coating including a second layer including silicon carbide, while maintaining the nozzle plate at a second deposition temperature not larger than 250° C.; positioning the nozzle plate onto the ink barrier layer by bringing into contact the second coating layer with the ink barrier layer. The first layer is deposited before the second layer.

Abstract: This invention relates to a method of inkjet printing, in particular for use in POS systems. In particular the printing method according to the invention is of the thermal type. In order to obtain high speed printing, for example of 15-20 lines per second when printing text on a paper medium 60-80 mm wide (for example receipts), the drops of ink ejected during the printing operation advantageously have a relatively large volume, i.e. not less than approximately 100 picoliters (pl) and preferably between 100 and 200 pl. The ink used for applications in POS systems must quickly penetrate an extensive range of paper media. This requirement is satisfied by using an ink having a surface tension of not more than approximately 35 dyne/cm (mN/m). Problems of stagnation and dripping of the ink caused by the printing conditions are overcome through the use of a nozzle plate coated with a wetting-resistant layer of silicon carbide.

Abstract: This invention relates to a method of inkjet printing, in particular for use in POS systems. In particular the printing method according to the invention is of the thermal type. In order to obtain high speed printing, for example of 15-20 lines per second when printing text on a paper medium 60-80 mm wide (for example receipts), the drops of ink ejected during the printing operation advantageously have a relatively large volume, i.e. not less than approximately 100 picolitres (pl) and preferably between 100 and 200 pl. The ink used for applications in POS systems must quickly penetrate an extensive range of paper media. This requirement is satisfied by using an ink having a surface tension of not more than approximately 35 dyne/cm (mN/m). Problems of stagnation and dripping of the ink caused by the printing conditions are overcome through the use of a nozzle plate coated with a wetting-resistant layer of silicon carbide.

Abstract: This invention relates to a method of manufacturing an ink jet printhead, said printhead comprising a substrate and an ink barrier layer formed on said substrate, said method comprising the steps of: arranging a nozzle plate in which there is formed a plurality of nozzles suitable for the ejection of ink drops, said nozzle plate comprising an upper surface and a lower surface, said upper surface being on the side of the ejection of ink drops and said lower surface being opposite to said upper surface; depositing on said upper surface a first coating including a first layer comprising silicon carbide, while maintaining said nozzle plate at a first deposition temperature not larger than 250° C.; depositing on said lower surface a second coating including a second layer comprising silicon carbide, while maintaining said nozzle plate at a second deposition temperature not larger than 250° C.