Patents by Inventor Danlu Tang

Danlu Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7797663
    Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (?Via) having a conductive dome disposed above the outer layer pad of the ?Via. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: September 14, 2010
    Assignee: Cisco Technology, Inc.
    Inventors: Steven C. Bird, Varoujan Malian, Mudasir Ahmad, Charles H. Casale, Danlu Tang
  • Publication number: 20080250377
    Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (?Via) having a conductive dome disposed above the outer layer pad of the ?Via. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Inventors: Steven C. Bird, Varoujan Malian, Mudasir Ahmad, Charles H. Casale, Danlu Tang