Abstract: Systems, processes and devices are provided for wafer-level fabrication of a resonator. A process is provided that includes chemical etching of glass and silicon, high-temperature glassblowing, controlling assembly of at least one YIG sphere relative to a nest structure, and plasma assisted wafer bonding. The process can include formation of loop coils and spherical coils defined by the glassblowing process including inner and outer hemispherical structures. The inner hemispherical structure may provide loops to drive and detect resonance in YIG spheres. Processes discussed herein allow for placement of loops in close proximity (e.g., few microns) to ferrimagnetic elements. The outer hemisphere may provide harmonic magnetic coils for frequency tuning. Embodiments are also directed to a resonator including first and second wafer-level glass blown wafer stacks each with inner hemisphere and outer hemispheres.

Abstract: Systems, processes and devices are provided for laser-based manufacturing of resonators and MEMS devices from bulk material including optically transparent material. Processes include digital marking of resonator structures in bulk material through non-linear interaction of ultrafast laser beam inscribing and material. The resonator structure may be defined and released through selective wet etching of the laser-modified areas, utilizing a combination of basic and acidic aqueous solutions. Processes can also include hydrofluoric thinning prior to wet etching to prevent laser surface damages. Systems and processes can pattern and fabricate resonator structures and concentricring structures. Embodiments provide miniaturized vibratory sensors from low loss material, such as fused silica and quartz, with an improved resolution and accuracy of measurements for inertial sensing, time referencing, bio-sensing and acoustic sensing.