Patents by Inventor Danna Rosenberg

Danna Rosenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10658424
    Abstract: A superconducting integrated circuit includes at least one superconducting resonator, including a substrate, a conductive layer disposed over a surface of the substrate with the conductive layer including at least one conductive material including a substantially low stress polycrystalline Titanium Nitride (TiN) material having an internal stress less than about two hundred fifty MPa (magnitude) such that the at least one superconducting resonator and/or qubit (hereafter called “device”) is provided as a substantially high quality factor, low loss superconducting device.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: May 19, 2020
    Assignee: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: William D. Oliver, Rabindra N. Das, David J. Hover, Danna Rosenberg, Xhovalin Miloshi, Vladimir Bolkhovsky, Jonilyn L. Yoder, Corey W. Stull, Mark A. Gouker
  • Patent number: 10396269
    Abstract: A multi-layer semiconductor structure includes a first semiconductor structure and a second semiconductor structure, with at least one of the first and second semiconductor structures provided as a superconducting semiconductor structure. The multi-layer semiconductor structure also includes one or more interconnect structures. Each of the interconnect structures is disposed between the first and second semiconductor structures and coupled to respective ones of interconnect pads provided on the first and second semiconductor structures. Additionally, each of the interconnect structures includes a plurality of interconnect sections. At least one of the interconnect sections includes at least one superconducting and/or a partially superconducting material.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: August 27, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Patent number: 10199553
    Abstract: Described are concepts, systems, circuits and techniques related to shielded through via structures and methods for fabricating such shielded through via structures. The described shielded through via structures and techniques allow for assembly of multi-layer semiconductor structures including one or more superconducting semiconductor structures (or integrated circuits).
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: February 5, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Patent number: 10134972
    Abstract: A cryogenic quantum bit package with multiple qubit circuits facilitates inter-qubit signal propagation using a multi-chip module (MCM). Multiple qubits are grouped within the package into one or more qubit integrated circuits (ICs). The qubit ICs themselves are electrically coupled to each other via a structure including a superconducting MCM and superconducting interconnects. Coupling of quantum electrical signals between a qubit and other qubits, a substrate, or the MCM uses a coupler circuit, such as a Josephson junction, capacitor, inductor, or resonator.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: November 20, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Patent number: 10121754
    Abstract: A method of fabricating an interconnect structure includes providing a semiconductor structure and performing a first spin resist and bake cycle. The first spin resist and bake cycle includes applying a first predetermined amount of a resist material over one or more portions of the semiconductor structure and baking the semiconductor structure to form a first resist layer portion of a resist layer. The method also includes performing a next spin resist and bake cycle. The next spin resist and bake cycle includes applying a next predetermined amount of the resist material and baking the semiconductor structure to form a next resist layer portion of the resist layer. The method additionally includes depositing a conductive material in an opening formed in the resist layer and forming a conductive structure from the conductive material. An interconnect structure is also provided.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: November 6, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Publication number: 20180247974
    Abstract: A superconducting integrated circuit includes at least one superconducting resonator, including a substrate, a conductive layer disposed over a surface of the substrate with the conductive layer including at least one conductive material including a substantially low stress polycrystalline Titanium Nitride (TiN) material having an internal stress less than about two hundred fifty MPa (magnitude) such that the at least one superconducting resonator and/or qubit (hereafter called “device”) is provided as a substantially high quality factor, low loss superconducting device.
    Type: Application
    Filed: July 21, 2016
    Publication date: August 30, 2018
    Inventors: William D. Oliver, Rabindra N. Das, David J. Hover, Danna Rosenberg, Xhovalin Miloshi, Vladimir Bolkhovsky, Jonilyn L. Yoder, Corey W. Stull, Mark A. Gouker
  • Publication number: 20180012932
    Abstract: A multi-layer semiconductor structure includes a first semiconductor structure and a second semiconductor structure, with at least one of the first and second semiconductor structures provided as a superconducting semiconductor structure. The multi-layer semiconductor structure also includes one or more interconnect structures. Each of the interconnect structures is disposed between the first and second semiconductor structures and coupled to respective ones of interconnect pads provided on the first and second semiconductor structures. Additionally, each of the interconnect structures includes a plurality of interconnect sections. At least one of the interconnect sections includes at least one superconducting and/or a partially superconducting material.
    Type: Application
    Filed: November 3, 2016
    Publication date: January 11, 2018
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Publication number: 20180013052
    Abstract: Quantum bit (qubit) circuits, coupler circuit structures and coupling techniques are described. Such circuits and techniques may be used to provide multi-qubit circuits suitable for use in multichip modules (MCMs).
    Type: Application
    Filed: November 3, 2016
    Publication date: January 11, 2018
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Patent number: 9680641
    Abstract: Techniques and tools for quantum key distribution (“QKD”) between a quantum communication (“QC”) card, base station and trusted authority are described herein. In example implementations, a QC card contains a miniaturized QC transmitter and couples with a base station. The base station provides a network connection with the trusted authority and can also provide electric power to the QC card. When coupled to the base station, after authentication by the trusted authority, the QC card acquires keys through QKD with a trust authority. The keys can be used to set up secure communication, for authentication, for access control, or for other purposes. The QC card can be implemented as part of a smart phone or other mobile computing device, or the QC card can be used as a fillgun for distribution of the keys.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: June 13, 2017
    Assignee: Los Alamos National Security, LLC
    Inventors: Jane E. Nordholt, Richard John Hughes, Raymond Thorson Newell, Charles Glen Peterson, Danna Rosenberg, Kevin Peter McCabe, Kush T. Tyagi, Nicholas Dallmann
  • Publication number: 20170133336
    Abstract: A method of fabricating an interconnect structure includes providing a semiconductor structure and performing a first spin resist and bake cycle. The first spin resist and bake cycle includes applying a first predetermined amount of a resist material over one or more portions of the semiconductor structure and baking the semiconductor structure to form a first resist layer portion of a resist layer. The method also includes performing a next spin resist and bake cycle. The next spin resist and bake cycle includes applying a next predetermined amount of the resist material and baking the semiconductor structure to form a next resist layer portion of the resist layer. The method additionally includes depositing a conductive material in an opening formed in the resist layer and forming a conductive structure from the conductive material. An interconnect structure is also provided.
    Type: Application
    Filed: November 3, 2016
    Publication date: May 11, 2017
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Publication number: 20160065365
    Abstract: Techniques and tools for quantum key distribution (“QKD”) between a quantum communication (“QC”) card, base station and trusted authority are described herein. In example implementations, a QC card contains a miniaturized QC transmitter and couples with a base station. The base station provides a network connection with the trusted authority and can also provide electric power to the QC card. When coupled to the base station, after authentication by the trusted authority, the QC card acquires keys through QKD with a trust authority. The keys can be used to set up secure communication, for authentication, for access control, or for other purposes. The QC card can be implemented as part of a smart phone or other mobile computing device, or the QC card can be used as a fillgun for distribution of the keys.
    Type: Application
    Filed: April 6, 2015
    Publication date: March 3, 2016
    Applicant: Los Alamos National Security, LLC
    Inventors: Jane E. NORDHOLT, Richard John HUGHES, Raymond Thorson NEWELL, Charles Glen PETERSON, Danna ROSENBERG, Kevin Peter MCCABE, Kush T. TYAGI, Nicholas DALLMANN
  • Patent number: 9002009
    Abstract: Techniques and tools for quantum key distribution (“QKD”) between a quantum communication (“QC”) card, base station and trusted authority are described herein. In example implementations, a QC card contains a miniaturized QC transmitter and couples with a base station. The base station provides a network connection with the trusted authority and can also provide electric power to the QC card. When coupled to the base station, after authentication by the trusted authority, the QC card acquires keys through QKD with a trusted authority. The keys can be used to set up secure communication, for authentication, for access control, or for other purposes. The QC card can be implemented as part of a smart phone or other mobile computing device, or the QC card can be used as a fillgun for distribution of the keys.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: April 7, 2015
    Assignee: Los Alamos National Security, LLC
    Inventors: Jane Elizabeth Nordholt, Richard John Hughes, Raymond Thorson Newell, Charles Glen Peterson, Danna Rosenberg, Kevin Peter McCabe, Kush T. Tyagi, Nicholas Dallman
  • Publication number: 20130101119
    Abstract: Techniques and tools for quantum key distribution (“QKD”) between a quantum communication (“QC”) card, base station and trusted authority are described herein. In example implementations, a QC card contains a miniaturized QC transmitter and couples with a base station. The base station provides a network connection with the trusted authority and can also provide electric power to the QC card. When coupled to the base station, after authentication by the trusted authority, the QC card acquires keys through QKD with a trusted authority. The keys can be used to set up secure communication, for authentication, for access control, or for other purposes. The QC card can be implemented as part of a smart phone or other mobile computing device, or the QC card can be used as a fillgun for distribution of the keys.
    Type: Application
    Filed: September 30, 2010
    Publication date: April 25, 2013
    Applicant: Los Alamos National Security LLC
    Inventors: Jane Elizabeth Nordholt, Richard John Hughes, Raymond Thorson Newell, Charles Glen Peterson, Danna Rosenberg, Kevin Peter McCabe, Kush T. Tyagi, Nicholas Dallmann