Abstract: A method and device for displaying reference content, and a storage medium thereof are provided. In some embodiments, the method includes displaying a first interface in response to an operation of enabling the first interface; displaying multiple second interfaces on the first interface in a form of floating window in response to an operation of enabling reference content, the multiple second interfaces including different reference content respectively; and displaying, in response to an operation of selecting a second interface from the multiple second interfaces, the selected second interface on the first interface in an overlaying manner. The formation arranging efficiency and communication efficiency between game players and the reference content can be improved by the above technical solution.

Abstract: A multilayer wiring coupling dual interface card carrier tape module is provided, including: a carrier tape base layer, an electrode diaphragm layer, a tuning capacitance layer, a radio-frequency identification coil layer, a bonding pad and a via hole. One surface of the carrier-band base layer is the front surface of the carrier-band module, and the other surface of the carrier-band base layer is the back surface of the carrier-band module. The electrode diaphragm layer and the tuning capacitance layer are located on the front surface of the carrier-band base layer, and the radio-frequency identification coil layer and the bonding pad are located on the back surface of the carrier-band base layer. The bonding pad is arranged according to a pin position of a chip. Hole metallization processing is conducted on the via hole for realizing an electrical connection between the electrode diaphragm layer and the bonding pad.

Abstract: A method and device for displaying reference content, and a storage medium thereof are provided. In some embodiments, the method includes displaying a first interface in response to an operation of enabling the first interface; displaying multiple second interfaces on the first interface in a form of floating window in response to an operation of enabling reference content, the multiple second interfaces including different reference content respectively; and displaying, in response to an operation of selecting a second interface from the multiple second interfaces, the selected second interface on the first interface in an overlaying manner. The formation arranging efficiency and communication efficiency between game players and the reference content can be improved by the above technical solution.

Abstract: A multilayer wiring coupling dual interface card carrier tape module is provided, including: a carrier tape base layer, an electrode diaphragm layer, a tuning capacitance layer, a radio-frequency identification coil layer, a bonding pad and a via hole. One surface of the carrier-band base layer is the front surface of the carrier-band module, and the other surface of the carrier-band base layer is the back surface of the carrier-band module. The electrode diaphragm layer and the tuning capacitance layer are located on the front surface of the carrier-band base layer, and the radio-frequency identification coil layer and the bonding pad are located on the back surface of the carrier-band base layer. The bonding pad is arranged according to a pin position of a chip. Hole metallization processing is conducted on the via hole for realizing an electrical connection between the electrode diaphragm layer and the bonding pad.

Abstract: A multilayer wiring type dual-interface IC card antenna module includes: an electrode diaphragm layer, including an antenna and an electrode diaphragm; a clamping base layer including eight first through hole points right below eight metal contacts on the electrode diaphragm; an RFID antenna layer including an RFID antenna, a connecting contact, a first chip attaching point and a second chip attaching point; an insulation layer including eight second through hole points located right below the eight first through hole points, a third through hole point located right below the connecting contact, a fourth through hole point located right below the first chip attaching point, and a fifth through hole point located right below the second chip attaching point; and a bridge layer connected with the second chip attaching point and the connecting contact in a bridging manner. The antenna module can achieve full-automatic production.

Abstract: Disclosed is a multilayer wiring type double-interface IC card antenna module, comprising: an electrode diaphragm layer (1), a clamping base layer (2), an RFID antenna layer (3), an insulation layer (4) and a bridge layer (5). The electrode diaphragm layer (1) comprises an antenna and an electrode diaphragm. The clamping base layer (2) is arranged below the electrode diaphragm layer (1), and comprises eight first through hole points (21) located right below eight metal contacts on the electrode diaphragm. The MID antenna layer (3) is arranged below the clamping base layer (2), and comprises an RFID antenna, a connecting contact, a first chip attaching point and a second chip attaching point, the connecting contact and the first chip attaching point being connected to two ends of the RFID antenna.