Patents by Inventor Danny Chih Hsun LIN

Danny Chih Hsun LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTOELECTRONIC PACKAGE AND METHOD FOR MAKING SAME
    Publication number: 20150348953
    Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.
    Type: Application
    Filed: August 7, 2015
    Publication date: December 3, 2015
    Inventors: Dennis Tak Kit Tong, Vincent Wai Hung, Danny Chih Hsun Lin, Francis Guillen Gamboa
  • Optoelectronic package and method for making same
    Patent number: 9142693
    Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: September 22, 2015
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Dennis Tak Kit Tong, Vincent Wai Hung, Danny Chih Hsun Lin, Francis Guillen Gamboa
  • OPTOELECTRONIC PACKAGE AND METHOD FOR MAKING SAME
    Publication number: 20130270584
    Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.
    Type: Application
    Filed: April 11, 2013
    Publication date: October 17, 2013
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Dennis Tak Kit TONG, Vincent Wai HUNG, Danny Chih Hsun LIN, Francis Guillen GAMBOA