Abstract: One embodiment of the present invention provides a system that regulates communications between a plurality of transmitters and a receiver. The system comprises a plurality of cells, wherein each cell controls communications from a transmitter in the plurality of transmitters to the receiver. A single token flows through a ring which passes through the plurality of cells, wherein the presence of the token within a cell indicates that the corresponding transmitter may communicate with the receiver.

Abstract: One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.

Abstract: A system that facilitates high-speed signaling between integrated circuit chips comprising a cable, wherein the cable includes a first and second active connector that facilitate communication between integrated circuit chips. The first active connector includes a capacitive receiver which receives a signal from a corresponding capacitive transmitter located on a first integrated circuit chip through capacitive coupling, and a transmitter which transmits a signal received by the capacitive receiver, through the interconnect medium within the cable, to the second active connector. The second active connector includes a receiver which receives a signal transmitted through the interconnect medium of the cable, and a capacitive transmitter which transmits the signal to a corresponding capacitive receiver located on a second integrated circuit chip through capacitive coupling.

Abstract: A system that facilitates high-speed data transfer between integrated circuit chips. The system contains a first integrated circuit chip, which includes a capacitive receiver and an electrical-to-optical transceiver. The capacitive receiver receives a capacitively coupled voltage signal transmitted from a corresponding capacitive transmitter located on a second integrated circuit chip and converts the capacitively coupled voltage signal into an electrical signal. The electrical-to-optical transceiver converts the electrical signal to an optical signal and transmits the optical signal to an optical device through optical coupling.

Abstract: One embodiment of the present invention provides a system that performs a carry-save division operation that divides a numerator, N, by a denominator, D, to produce an approximation of the quotient, Q=N/D. The system approximates Q by iteratively selecting an operation to perform based on higher order bits of a remainder, r, and then performing the operation, wherein the operation can include, subtracting D from r and adding a coefficient c to a quotient calculated thus far q, or adding D to r and subtracting c from q. These subtraction and addition operations maintain r and q in carry-save form, which eliminates the need for carry propagation and thereby speeds up the division operation. Furthermore, the selection logic is simpler than previous SRT division implementations, which provides another important speed up.

Abstract: One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.

Abstract: One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.

Abstract: A system, including at least one central processing unit, at least one memory unit, and a plurality of integrated circuits that form a switching fabric configured to propagate data packets between the at least one central processing unit and the at least one memory unit, wherein the switching fabric is constructed using at least two directed acyclic graph (DAG) networks.

Abstract: A plurality of integrated circuit packages are disposed on a substrate. The plurality of integrated circuit packages includes a first type of integrated circuit package that has an inactive side facing the substrate and an active side facing away from the substrate. The plurality of integrated circuit packages also includes a second type of integrated circuit package that has an inactive side facing away from the substrate and an active side facing the substrate. The first type of integrated circuit package and the second type of integrated circuit package are disposed such that a proximity communication enabled portion of the first type of integrated circuit package is aligned with a proximity communication enabled portion of the second type of integrated circuit package.

Abstract: Embodiments of an encoding circuit to communicate a sequence of words are described. This encoding circuit includes an encoding module that is configured to receive a first sequence of words and to generate a DC-balanced second sequence of words based on the first sequence of words, where communicating the second sequence of words consumes less energy than communicating a third sequence of words that includes words in the first sequence of words alternating with words in the inverse of the first sequence of words. In addition, the second sequence of words includes substantially twice as many words as the first sequence of words.

Abstract: One embodiment of the present invention provides a system that regulates communications between a plurality of transmitters and a receiver. The system comprises a plurality of cells, wherein each cell controls communications from a transmitter in the plurality of transmitters to the receiver. A single token flows through a ring which passes through the plurality of cells, wherein the presence of the token within a cell indicates that the corresponding transmitter may communicate with the receiver.

Abstract: One embodiment of the present invention provides a system that performs a carry-save division operation that divides a numerator, N, by a denominator, D, to produce an approximation of the quotient, Q=N/D. The system approximates Q by iteratively selecting an operation to perform based on higher order bits of a remainder, r, and then performing the operation, wherein the operation can include, subtracting D from r and adding a coefficient c to a quotient calculated thus far q, or adding D to r and subtracting c from q. These subtraction and addition operations maintain r and q in carry-save form, which eliminates the need for carry propagation and thereby speeds up the division operation. Furthermore, the selection logic is simpler than previous SRT division implementations, which provides another important speed up.