Patents by Inventor DANNY DO

DANNY DO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for mounting a MEMS sensor for in-stream measurements
    Patent number: 9969608
    Abstract: Systems and methods for packaging a MEMS device to measure the in-stream pressure within a pipe are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, the MEMS device is mounted directly to the pipe using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal pipe.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: May 15, 2018
    Assignee: DUNAN SENSING, LLC
    Inventors: Tom Kwa, Danny Do, Gary Winzeler, Emir Vukotic
  • Methods and apparatus for packaging a MEMS device
    Patent number: 9874486
    Abstract: Systems and methods for packaging a MEMS device are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, a metal port is mounted directly to the MEMS device using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal port.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: January 23, 2018
    Assignee: DUNAN SENSING, LLC
    Inventors: Gary Winzeler, Danny Do, Cuong D. Nguyen, Emir Vukotic
  • METHODS AND APPARATUS FOR PACKAGING A MEMS DEVICE
    Publication number: 20170191892
    Abstract: Systems and methods for packaging a MEMS device are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, a metal port is mounted directly to the MEMS device using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal port.
    Type: Application
    Filed: January 5, 2016
    Publication date: July 6, 2017
    Inventors: Gary Winzeler, Danny Do, Cuong D. Nguyen, Emir Vukotic
  • METHODS FOR MOUNTING A MEMS SENSOR FOR IN-STREAM MEASUREMENTS
    Publication number: 20170190570
    Abstract: Systems and methods for packaging a MEMS device to measure the in-stream pressure within a pipe are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, the MEMS device is mounted directly to the pipe using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal pipe.
    Type: Application
    Filed: March 14, 2016
    Publication date: July 6, 2017
    Inventors: TOM KWA, DANNY DO, GARY WINZELER, EMIR VUKOTIC