Patents by Inventor Danny E. Massey

Danny E. Massey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6802733
    Abstract: An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and springplate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: October 12, 2004
    Assignee: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Jr., Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha
  • Patent number: 6757965
    Abstract: A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: July 6, 2004
    Assignee: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Jr., Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha, Charles C. Stratton
  • Patent number: 6634095
    Abstract: An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: October 21, 2003
    Assignee: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Jr., Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha, Charles C. Stratton
  • Publication number: 20030192180
    Abstract: An installation apparatus and method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
    Type: Application
    Filed: June 5, 2003
    Publication date: October 16, 2003
    Inventors: John L. Colbert, John S. Corbin, Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha, Charles C. Stratton
  • Publication number: 20030036301
    Abstract: An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and spring plate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.
    Type: Application
    Filed: August 16, 2001
    Publication date: February 20, 2003
    Applicant: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha
  • Publication number: 20030000080
    Abstract: An installation apparatus and method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
    Type: Application
    Filed: June 27, 2001
    Publication date: January 2, 2003
    Applicant: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha, Charles C. Stratton
  • Patent number: 6475011
    Abstract: An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: November 5, 2002
    Assignee: International Business Machines Corporation
    Inventors: Arvind K. Sinha, Roger D. Hamilton, John L. Colbert, John S. Corbin, Jr., Danny E. Massey
  • Patent number: 6449155
    Abstract: A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly cover. The module cap has shimmed load posts and adjustable brackets for precise alignment and loading of the interposer onto the module. The cover may have a springplate for precise preloading of the interposer onto the multichip module for transportation. The multichip module subassembly is easily used as a field replaceable unit.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: September 10, 2002
    Assignee: International Business Machines Corporation
    Inventors: John Lee Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Danny E. Massey, Arvind Kumar Sinha
  • Patent number: 6385044
    Abstract: An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: May 7, 2002
    Assignee: International Business Machines Corporation
    Inventors: John Lee Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Danny E. Massey, Arvind Kumar Sinha