Patents by Inventor Danny Edward Massey

Danny Edward Massey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
    Patent number: 5770891
    Abstract: A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact.
    Type: Grant
    Filed: September 18, 1996
    Date of Patent: June 23, 1998
    Assignee: International Business Machines Corporation
    Inventors: Richard Francis Frankeny, Jerome Albert Frankeny, Danny Edward Massey, Keith Allan Vanderlee
  • Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer
    Patent number: 5738531
    Abstract: A self-aligning low profile socket for connecting a ball grid array type device through a dendritic interposer to a printed circuit board, the socket providing resources for attaching a heat sink to the electronic device with minimum thermal impedance. Compressive forces are evenly distributed over the pattern of the interposer array, and thermal conductivity is provided between the top of the electronic device and a heat sink, through the use of complementary concave and convex surfaces engaged by a flat screw mechanism. The socket exhibits a low profile while providing the flexibility of a dendritic interposer and effective heat sink attachment.
    Type: Grant
    Filed: September 9, 1996
    Date of Patent: April 14, 1998
    Assignee: International Business Machines Corporation
    Inventors: Daniel Paul Beaman, John Saunders Corbin, Jr., Danny Edward Massey
  • Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
    Patent number: 5691041
    Abstract: A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact.
    Type: Grant
    Filed: September 29, 1995
    Date of Patent: November 25, 1997
    Assignee: International Business Machines Corporation
    Inventors: Richard Francis Frankeny, Jerome Albert Frankeny, Danny Edward Massey, Keith Allan Vanderlee