Patents by Inventor Danny F. Mathews

Danny F. Mathews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Application of an ozonated DI water spray to resist residue removal processes
    Publication number: 20020096256
    Abstract: A method and apparatus for resist strip. Wafers (108) with a patterned resist formed thereon are placed in a carrier (104) in a process chamber (102). An ozonated deionized water mist (120) is sprayed on the surface of wafer (108). The ozonated deionized water mist (120) strips the resist and removes the resist residue without the use of hazardous chemicals. The ozonated deionized water mist (120) may be formed in an atomizer that mixes deionized water (116) with ozone (118). The ozonated deionized water mist (120) is then sprayed onto the wafers (108) while the wafers are being rotated.
    Type: Application
    Filed: January 23, 2002
    Publication date: July 25, 2002
    Inventors: Neal T. Murphy, Claire Ching-Shan Jung, Danny F. Mathews
  • Ozonated DI water process for organic residue and metal removal processes
    Patent number: 6399513
    Abstract: A method for resist strip and metal contamination removal. Wafers (108) with a patterned resist formed thereon are subjected to an ozonated deionized water solution, such as mist (120). The ozonated deionized water solution (120) strips the resist and removes the resist residue. At the end of the process, HCl (152) is added to the deionized water (116) prior to forming the ozonated deionized water solution (120) to remove metal contaminants.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: June 4, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Neal T. Murphy, Claire Ching-Shan Jung, Danny F. Mathews
  • Application of an ozonated DI water spray to resist residue removal processes
    Patent number: 6387822
    Abstract: A method and apparatus for resist strip. Wafers (108) with a patterned resist formed thereon are placed in a carrier (104) in a process chamber (102). An ozonated deionized water mist (120) is sprayed on the surface of wafer (108). The ozonated deionized water mist (120) strips the resist and removes the resist residue without the use of hazardous chemicals. The ozonated deionized water mist (120) may be formed in an atomizer that mixes deionized water (116) with ozone (118). The ozonated deionized water mist (120) is then sprayed onto the wafers (108) while the wafers are being rotated.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: May 14, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Neal T. Murphy, Claire Ching-Shan Jung, Danny F. Mathews