Patents by Inventor Danny K. Petersen

Danny K. Petersen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adjustable thermal forming die assembly
    Patent number: 8919729
    Abstract: An adjustable thermal die assembly is provided. The thermal die assembly includes a thermal forming die and at least one insert. The thermal forming die has at least one die cavity of a select shape. The die further has at least one opening to the at least one die cavity. The at least one insert has at least one internal passage that is conformed to have a shape of the at least one opening to the at least one die cavity of the die. Moreover, the at least one insert is configured and arranged to be selectively coupled to the die with the at least one internal passage of the at least one insert aligning with the at least one opening of the at least one die cavity to selectively increase a depth of a forming cavity of the thermal forming assembly.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: December 30, 2014
    Assignee: Hormel Foods Corporation
    Inventors: Daniel S. Miller, Steven E. Sampson, LouJean Reid, Frank D. Fryer, Danny K. Petersen, Kurt A. Lindsey
  • ADJUSTABLE THERMAL FORMING DIE ASSEMBLY
    Publication number: 20120286446
    Abstract: An adjustable thermal die assembly is provided. The thermal die assembly includes a thermal forming die and at least one insert. The thermal forming die has at least one die cavity of a select shape. The die further has at least one opening to the at least one die cavity. The at least one insert has at least one internal passage that is conformed to have a shape of the at least one opening to the at least one die cavity of the die. Moreover, the at least one insert is configured and arranged to be selectively coupled to the die with the at least one internal passage of the at least one insert aligning with the at least one opening of the at least one die cavity to selectively increase a depth of a forming cavity of the thermal forming assembly.
    Type: Application
    Filed: May 12, 2011
    Publication date: November 15, 2012
    Inventors: Daniel S. Miller, Steven E. Sampson, LouJean Reid, Frank D. Fryer, Danny K. Petersen, Kurt A. Lindsey