Abstract: The improved cosmetic depotting device includes an induction coil that selectively heats a conductive cosmetic pan placed on a surface above the induction coil sufficiently to loosen the adhesive bond between the cosmetic pan and the retail package within which it is contained. A microcontroller switches the operating frequency of the induction coil to effect adequate heating of low mass standard cosmetic pans. A retail makeup package is placed on the heating surface, the device is powered on and the heat setting raised until the cosmetic pan adhesive is sufficiently softened to allow removal from the retail packaging. Makeup compounds may also be melted for placement in a chosen cosmetic pan for subsequent placement in a configurable makeup organizer Safe heating and depotting of makeup compounds makes the device ideal for use in a commercial setting, for example, in a kiosk near a department store of a shopping mall.