Patents by Inventor Danny Lim

Danny Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10071575
    Abstract: Printer is provided having support base on which print media travels. Printer includes thickness detection module and processor. Thickness detection module includes pinch arm assembly with pinch arm having first and second ends, encoder, and proximate dual channel encoder sensor. First end is biased toward support base. Encoder with number of circumferentially spaced line pairs is disposed at second end. Pinch arm and encoder configured to rotate in response to engagement of pinch arm with at least print media portion. Dual channel encoder sensor configured to detect rotation direction and encoder count and output signal representing encoder count. Encoder count is number of circumferentially spaced line pairs that pass by dual channel encoder sensor as pinch arm and encoder rotate. Processor is communicatively coupled to dual channel encoder sensor and configured to receive signal and calculate print media thickness of portion from encoder count using conversion factor.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: September 11, 2018
    Assignee: Datamax-O'Neil Corporation
    Inventors: Boon Kheng Lim, Aravindkumar Harinarayanan, Danny Lim
  • Publication number: 20180201035
    Abstract: Printer is provided having support base on which print media travels. Printer includes thickness detection module and processor. Thickness detection module includes pinch arm assembly with pinch arm having first and second ends, encoder, and proximate dual channel encoder sensor. First end is biased toward support base. Encoder with number of circumferentially spaced line pairs is disposed at second end. Pinch arm and encoder configured to rotate in response to engagement of pinch arm with at least print media portion. Dual channel encoder sensor configured to detect rotation direction and encoder count and output signal representing encoder count. Encoder count is number of circumferentially spaced line pairs that pass by dual channel encoder sensor as pinch arm and encoder rotate. Processor is communicatively coupled to dual channel encoder sensor and configured to receive signal and calculate print media thickness of portion from encoder count using conversion factor.
    Type: Application
    Filed: October 27, 2017
    Publication date: July 19, 2018
    Inventors: Boon Kheng Lim, Aravindkumar Harinarayanan, Danny Lim
  • Patent number: 9802427
    Abstract: Printer is provided having support base on which print media travels. Printer includes thickness detection module and processor. Thickness detection module includes pinch arm assembly with pinch arm having first and second ends, encoder, and proximate dual channel encoder sensor. First end is biased toward support base. Encoder with number of circumferentially spaced line pairs is disposed at second end. Pinch arm and encoder configured to rotate in response to engagement of pinch arm with at least print media portion. Dual channel encoder sensor configured to detect rotation direction and encoder count and output signal representing encoder count. Encoder count is number of circumferentially spaced line pairs that pass by dual channel encoder sensor as pinch arm and encoder rotate. Processor is communicatively coupled to dual channel encoder sensor and configured to receive signal and calculate print media thickness of portion from encoder count using conversion factor.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: October 31, 2017
    Assignee: Datamax-O'Neil Corporation
    Inventors: Boon Kheng Lim, Aravindkumar Harinarayanan, Danny Lim
  • Patent number: 7166015
    Abstract: An apparatus for use in a chemical mechanical planarization system is provided. The apparatus includes a fluid displacing device and a fluid delivery device. The fluid displacing device is capable of being positioned at a proximate location over a polishing pad, the fluid displacing device configured to displace at least part of a first fluid from a region of the polishing pad. The fluid delivery device is capable of replacing the displaced first fluid with a second fluid at the region of the polishing pad, the second fluid being different than the first fluid. A method of controlling properties of a film present over a polishing pad surface is also provided.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: January 23, 2007
    Assignee: Lam Research Corporation
    Inventors: Yehiel Gotkis, Danny Lim
  • Publication number: 20040219867
    Abstract: An apparatus for use in a chemical mechanical planarization system is provided. The apparatus includes a fluid displacing device and a fluid delivery device. The fluid displacing device is capable of being positioned at a proximate location over a polishing pad, the fluid displacing device configured to displace at least part of a first fluid from a region of the polishing pad. The fluid delivery device is capable of replacing the displaced first fluid with a second fluid at the region of the polishing pad, the second fluid being different than the first fluid. A method of controlling properties of a film present over a polishing pad surface is also provided.
    Type: Application
    Filed: December 19, 2003
    Publication date: November 4, 2004
    Applicant: LAM RESEARCH CORPORATION
    Inventors: Yehiel Gotkis, Danny Lim