Abstract: The present disclosure is directed to systems and methods for cooling an electric aircraft. The system comprises an electronic device, a casing, a fin, and at least one PHP. The casing comprises an inner surface. A PHP may be coupled to the inner surface. The fin comprises a fin interior cavity. A PHP may be embedded within the fin interior cavity. The same PHP may be both coupled to the casing inner surface and embedded within the fin interior cavity, or there may be a plurality of fins such that at least one fin is coupled to the casing inner surface and at least one fin is embedded within the fin interior cavity. The portion of the PHP closest to the electronic device comprises an evaporator section and the portion of the PHP furthest from the electronic device comprises a condenser section.

Abstract: The present disclosure is directed to systems for cooling an electric aircraft. The system comprises an electronic device, a casing, and at least one PHP. The electronic device can generate heat. The electronic device can be housed within the casing. The casing comprises a casing inner wall and a casing outer wall wherein a first casing width is between the casing outer wall and the casing inner wall, and at least one PHP embedded in the first casing width. The casing may also comprise a casing inner base and a casing outer base wherein a second casing width is between the casing inner base and the casing outer base. The first casing width and second with may comprise a single fluidly connected channel with a connecting point, and a PHP may be embedded into the single fluidly connected channel. The system may be configured for use on an eVTOL.

Abstract: The present disclosure is directed to systems and methods for cooling an electric charging cable. The system includes a conductor core, a wick placed around an exterior of the conductor core, an outer cover surrounding the wick, wherein the outer cover comprises an inner surface, and wherein a space is formed between the wick and the inner surface of the outer cover, and one or more channels disposed within the space between the wick and the inner surface of the outer cover and coupled to the wick, wherein the one or more channels includes an outer surface and wherein the outer surface of the one or more channels is placed a distance from the inner surface of the outer cover.

Abstract: Impingement cooling systems, electronic motor assemblies, and electric vertical take-off and landing (eVTOL) systems are disclosed. In one embodiment, an impingement cooling system includes an electronic device casing downstream a propulsion air-flow and one or more electronic devices housed in the electronic device casing. A plurality of fins extend from the electronic device casing. At least one of the plurality of fins is an airfoil fin. The airfoil fin includes a high-pressure side with an air inlet that receives the propulsion air-flow. An inner conduit is fluidly coupled to the air inlet and directs the propulsion air-flow over the electronic device casing. A low-pressure side with an air outlet is fluidly coupled to the inner conduit. The air outlet expels the propulsion air-flow into the atmosphere.

Abstract: Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface. The evaporator assembly further includes a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents.

Abstract: In one embodiment, a method of fabricating a porous structure includes applying a first electroplating current at first current density for a first period of time, wherein the first electroplating current is a constant current, and applying a second electroplating current at a second current density for a second period of time following the first period of time, wherein the second electroplating current is a pulsed current and the first electroplating current and the second electroplating current grows the porous structure on a surface of the substrate.

Abstract: Porous structures and processes for generating porous structures are disclosed. In one embodiment, a porous structure includes a target surface, a photoresist material deposited onto the target surface, and a metal electrodeposited onto the target surface and the photoresist material. An electrodeposition of metal generates a metal porous structure and the photoresist material is removed through reactive ion etching, generating at least one microchannel through the metal porous structure.

Abstract: A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.

Abstract: A vehicle system includes a controller programmed to display a plurality of icons on a HUD of the vehicle, receive EEG data from a driver of the vehicle, perform a Fast Fourier Transform of the EEG data to obtain an EEG spectrum, input the EEG spectrum into a trained machine learning model, determine which of the plurality of icons the driver is viewing based on an output of the trained machine learning model, and perform one or more vehicle operations based on the output of the trained machine learning model.

Abstract: One or more multi-zoned microreactor flow field configurations that facilitate optimized reaction-fluid performance, and one or more methods of designing such multi-zoned microreactor flow fields.

Abstract: The present disclosure is directed to systems and methods for cooling an electric aircraft. The system comprises an electronic device, a casing, at least one fin, and at least one PHP. The electronic device can generate heat. The electronic device can be housed within the casing. The fin can be attached to the outer wall of the casing. The PHP can be embedded within the fin, such that an evaporator section of the PHP is closest to the heat source and the condenser section of the PHP is furthest from the heat source. The PHP can also be placed within the casing. In some embodiments, the casing can have a plurality of slots. The fin can be shaped such that a single fin may slide into a pair of slots and come to rest adjacent to the casing, wherein a PHP can be embedded within the fin.

Abstract: Disclosed herein are an apparatus and method fluid flow measurements which include a pressure transducer and a flexible tube. The pressure transducer is tuned to measure flow speeds having a Reynolds number less than 100 and include an inlet. The flexible tube has a first end fluidly coupled to the inlet and a second end positioned adjacent to and in fluid communication with a plurality of fluid outlets of a microchannel flow structure. Each of the plurality of fluid outlets has a cross section defining an outlet area. The second end has a cross section defining a flexible tube area that is larger than the outlet area.

Abstract: Disclosed herein are an apparatus and method fluid flow measurements which include a pressure transducer and a flexible tube. The pressure transducer is tuned to measure flow speeds having a Reynolds number less than 100 and include an inlet. The flexible tube has a first end fluidly coupled to the inlet and a second end positioned adjacent to and in fluid communication with a plurality of fluid outlets of a microchannel flow structure. Each of the plurality of fluid outlets has a cross section defining an outlet area. The second end has a cross section defining a flexible tube area that is larger than the outlet area.

Abstract: Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface. The evaporator assembly further includes a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents.

Abstract: Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.

Abstract: Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.

Abstract: A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.

Abstract: A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.

Abstract: A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.