Patents by Inventor Danny Lohan

Danny Lohan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240043145
    Abstract: The present disclosure is directed to systems and methods for cooling an electric aircraft. The system comprises an electronic device, a casing, at least one fin, and at least one PHP. The electronic device can generate heat. The electronic device can be housed within the casing. The fin can be attached to the outer wall of the casing. The PHP can be embedded within the fin, such that an evaporator section of the PHP is closest to the heat source and the condenser section of the PHP is furthest from the heat source. The PHP can also be placed within the casing. In some embodiments, the casing can have a plurality of slots. The fin can be shaped such that a single fin may slide into a pair of slots and come to rest adjacent to the casing, wherein a PHP can be embedded within the fin.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 8, 2024
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh JOSHI, Danny LOHAN
  • Patent number: 11885652
    Abstract: Disclosed herein are an apparatus and method fluid flow measurements which include a pressure transducer and a flexible tube. The pressure transducer is tuned to measure flow speeds having a Reynolds number less than 100 and include an inlet. The flexible tube has a first end fluidly coupled to the inlet and a second end positioned adjacent to and in fluid communication with a plurality of fluid outlets of a microchannel flow structure. Each of the plurality of fluid outlets has a cross section defining an outlet area. The second end has a cross section defining a flexible tube area that is larger than the outlet area.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: January 30, 2024
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ercan M. Dede, Yuqing Zhou, Feng Zhou, Danny Lohan
  • Publication number: 20230146582
    Abstract: Disclosed herein are an apparatus and method fluid flow measurements which include a pressure transducer and a flexible tube. The pressure transducer is tuned to measure flow speeds having a Reynolds number less than 100 and include an inlet. The flexible tube has a first end fluidly coupled to the inlet and a second end positioned adjacent to and in fluid communication with a plurality of fluid outlets of a microchannel flow structure. Each of the plurality of fluid outlets has a cross section defining an outlet area. The second end has a cross section defining a flexible tube area that is larger than the outlet area.
    Type: Application
    Filed: November 5, 2021
    Publication date: May 11, 2023
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ercan M. Dede, Yuqing Zhou, Feng Zhou, Danny Lohan
  • Publication number: 20230138653
    Abstract: Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface. The evaporator assembly further includes a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents.
    Type: Application
    Filed: November 3, 2021
    Publication date: May 4, 2023
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Danny Lohan
  • Patent number: 11638359
    Abstract: Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: April 25, 2023
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Danny Lohan, Shailesh N. Joshi
  • Publication number: 20220361353
    Abstract: Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.
    Type: Application
    Filed: May 5, 2021
    Publication date: November 10, 2022
    Inventors: Danny Lohan, Shailesh N. Joshi
  • Publication number: 20220319956
    Abstract: A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.
    Type: Application
    Filed: March 30, 2021
    Publication date: October 6, 2022
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Ercan Mehmet Dede, Feng Zhou, Hiroshi Ukegawa, Danny Lohan
  • Patent number: 11457544
    Abstract: A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: September 27, 2022
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Shailesh N. Joshi, Danny Lohan, Hitoshi Fujioka, Feng Zhou
  • Publication number: 20220167528
    Abstract: A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.
    Type: Application
    Filed: February 2, 2021
    Publication date: May 26, 2022
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Danny Lohan, Hitoshi Fujioka, Feng Zhou