Patents by Inventor Danny R. Singh

Danny R. Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140001583
    Abstract: An apparatus including a die including a first side and an opposite second side including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the second side of the die, the build-up carrier including a plurality of alternating layers of conductive material and insulating material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the die; and at least one device within the build-up carrier disposed in an area void of a layer of patterned conductive material. A method and an apparatus including a computing device including a package including a microprocessor are also disclosed.
    Type: Application
    Filed: June 30, 2012
    Publication date: January 2, 2014
    Applicant: Intel Corporation
    Inventors: Weng Hong Teh, Zuoming Ming Zhao, Danny R. Singh