Abstract: Some embodiments provide an integrated circuit (“IC”) with a primary circuit structure. The primary circuit structure is for performing multiple operations that implement a user design. The primary circuit structure includes multiple circuits. The IC also includes a secondary monitoring structure for monitoring multiple operations. The secondary monitoring structure includes a network communicatively coupled to multiple circuits of the primary circuit structure. The secondary monitoring circuit structure is for analyzing the monitored operations and reporting on the analysis to a circuit outside of the IC.

Abstract: Some embodiments provide an integrated circuit (“IC”) with a primary circuit structure. The primary circuit structure is for performing multiple operations that implement a user design. The primary circuit structure includes multiple circuits. The IC also includes a secondary monitoring structure for monitoring multiple operations. The secondary monitoring structure includes a network communicatively coupled to multiple circuits of the primary circuit structure. The secondary monitoring circuit structure is for analyzing the monitored operations and reporting on the analysis to a circuit outside of the IC.

Abstract: Some embodiments provide an integrated circuit (“IC”) with a primary circuit structure. The primary circuit structure is for performing multiple operations that implement a user design. The primary circuit structure includes multiple circuits. The IC also includes a secondary monitoring structure for monitoring multiple operations. The secondary monitoring structure includes a network communicatively coupled to multiple circuits of the primary circuit structure. The secondary monitoring circuit structure is for analyzing the monitored operations and reporting on the analysis to a circuit outside of the IC.

Abstract: Some embodiments provide an integrated circuit (“IC”) with a primary circuit structure. The primary circuit structure is for performing multiple operations that implement a user design. The primary circuit structure includes multiple circuits. The IC also includes a secondary monitoring structure for monitoring multiple operations. The secondary monitoring structure includes a network communicatively coupled to multiple circuits of the primary circuit structure. The secondary monitoring circuit structure is for analyzing the monitored operations and reporting on the analysis to a circuit outside of the IC.

Abstract: Some embodiments provide an integrated circuit (“IC”) with a primary circuit structure. The primary circuit structure is for performing multiple operations that implement a user design. The primary circuit structure includes multiple circuits. The IC also includes a secondary monitoring structure for monitoring multiple operations. The secondary monitoring structure includes a network communicatively coupled to multiple circuits of the primary circuit structure. The secondary monitoring circuit structure is for analyzing the monitored operations and reporting on the analysis to a circuit outside of the IC.

Abstract: Methods, apparatuses and systems facilitating the aggregation or bonding of communications paths into a higher-bandwidth, logical communications path. Embodiments of the present invention can be applied to bond different physical links (e.g., xDSL over twisted pairs), different channels on the same physical line, or even different channels or frequencies in a wireless communications network. The present invention further provides methods, apparatuses and systems facilitating the re-sequencing of data flows transmitted across bonded communications paths. In one embodiment, the re-sequencing methodology of the present invention adapts to the transmission delays (both absolute and relative) across the bonded communications path.

Abstract: Methods, apparatuses and systems facilitating the aggregation or bonding of physical communications links into higher-bandwidth logical links. A novel link bonding and encapsulation protocol scheme that optimizes the efficiency of data transfer across the physical links, while still allowing for desired Quality of Service (QoS) levels to high-priority traffic, such as voice data, with low delay requirements. Data streams are divided and concurrently transported over multiple physical links that are aggregated or bonded together to form one logical link. At the receive end, the original cell streams are recovered from the bonded logical links. In one embodiment, the physical links are xDSL links transmitting and receiving signals via conventional copper twisted-pair cabling.

Abstract: A rate adjustable backplane includes a set of switch slots configured to receive one or more switch cards forming a switch core and a plurality of line slots each configured to receive a line card. A low speed bus couples the line slots to the set of switch slots. A high speed bus also couples the line slots to the set of switch slots. Each line slot includes a low speed connector coupled to the low speed bus and a high speed connector coupled to the high speed bus. The low speed connector is adapted to receive a mating connector of a line card to establish a low speed communication connection between the line card and the switch core. The high speed connector is adapted to receive a mating connector of the line card to establish a high speed link between the line card and the switch core.

Abstract: Methods, apparatuses and systems facilitating the aggregation or bonding of physical communications links into higher-bandwidth logical links. The present invention features a novel link bonding and encapsulation protocol scheme that, in one embodiment, optimizes the efficiency of data transfer across the physical links, while still allowing for desired Quality of Service (QoS) levels to high-priority traffic, such as voice data, with low delay requirements. Embodiments of the present invention allow a variety of service types to be transported transparently over bonded physical links. According to one embodiment, data streams are divided and concurrently transported over multiple physical links that are aggregated or bonded together to form one logical link. At the receive end, the original cell streams are recovered from the bonded logical links. In one embodiment, the physical links are xDSL links transmitting and receiving signals via conventional copper twisted-pair cabling.

Abstract: A switch card for telecommunications node includes a shared memory operable to store traffic channels. A time slot interchanger (TSI) is coupled to a first bus and to the shared memory. The TSI is operable based on predefined switching instructions to access the shared memory to stored traffic channels received from the first bus and to retrieve traffic channels for transmission on the first bus. An asynchronous transfer mode (ATM) switch is operable to switch a traffic cell based on header information in the traffic cell. A traffic converter is operable to convert traffic channels retrieved from the shared memory to traffic cells for processing by a bus fuser and to convert traffic cells to traffic channels for storage in the shared memory. The bus fuser is coupled to the shared memory through the traffic converter, the ATM switch, and a second bus.