Patents by Inventor Danny W. Echtle

Danny W. Echtle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of identifying a weakest interface where delamination is most likely to occur in a multi-layer dielectric film stack
    Patent number: 5493926
    Abstract: A method of identifying a weakest interface where delamination is most likely to occur in a multi-layer dielectric film stack formed on a semiconductor wafer includes scribing processed layers including the multi-layer dielectric film stack with an applied force of a selected and constant magnitude, measuring the depth of a cavity formed in the processed layers by such scribing, and identifying the weakest interface by comparing the measured depth against the known depths of the interfaces between adjacent layers of the multi-layer dielectric film stack.
    Type: Grant
    Filed: March 21, 1995
    Date of Patent: February 27, 1996
    Assignee: VLSI Technology, Inc.
    Inventors: Landon B. Vines, Felix H. Fujishiro, Danny W. Echtle, Annette Garcia