Patents by Inventor Danny Wan

Danny Wan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12087994
    Abstract: A method for forming a modified resonator is provided. In one aspect, the method includes obtaining a resonator on top of a substrate, thereby forming an interface area between a bottom surface of the resonator and a top surface of the substrate. The resonator can include niobium or tantalum. The method also includes contacting the resonator and the substrate with a liquid acidic etching solution selected so as to have a higher etch rate towards the substrate than towards the resonator and a nonzero etch rate towards the resonator.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: September 10, 2024
    Assignees: IMEC vzw, Katholieke Universiteit Leuven
    Inventors: Antoine Pacco, Massimo Mongillo, Anton Potocnik, Danny Wan, Jeroen Verjauw
  • Publication number: 20240297136
    Abstract: Superconducting solder bumps are produced on a qubit substrate by electrodeposition. The substrate comprises qubit areas, and superconducting contact pads connected to the qubit areas. First a protection layer is formed on the substrate, and patterned so as to cover at least the qubit areas. Then one or more thin layers are deposited conformally on the patterned protection layer, the thin layers comprising at least a non-superconducting layer suitable for acting as a seed layer for the electrodeposition of the solder bumps. The seed layer is removed locally in areas which lie within the surface area of respective contact pads. This is done by producing and patterning a mask layer, so that openings are formed therein, and by removing the seed layer from the bottom of the openings. The solder bumps are formed by electrodeposition of the solder material on the bottom of the openings. After the formation of the solder bumps, the seed layer and the protection layer are removed.
    Type: Application
    Filed: February 29, 2024
    Publication date: September 5, 2024
    Inventors: Jaber Derakhshandeh, Vadiraj Manjunath Ananthapadmanabha Rao, Danny Wan, Eric Beyne, Kristiaan De Greve, Anton Potocnik
  • Patent number: 11587708
    Abstract: In one aspect, the disclosed technology relates to a magnetic device, which may be a magnetic memory and/or logic device. The magnetic device can comprise a seed layer; a first free magnetic layer provided on the seed layer; an interlayer provided on the first free magnetic layer; a second free magnetic layer provided on the interlayer; a tunnel barrier provided on the second free magnetic layer; and a fixed magnetic layer. The first free magnetic layer and the second free magnetic layer can be ferromagnetically coupled across the interlayer through exchange interaction.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: February 21, 2023
    Assignees: IMEC vzw, Katholieke Universiteit Leuven
    Inventors: Van Dai Nguyen, Sebastien Couet, Olivier Bultynck, Danny Wan, Eline Raymenants
  • Publication number: 20220115759
    Abstract: A method for forming a modified resonator is provided. In one aspect, the method includes obtaining a resonator on top of a substrate, thereby forming an interface area between a bottom surface of the resonator and a top surface of the substrate. The resonator can include niobium or tantalum. The method also includes contacting the resonator and the substrate with a liquid acidic etching solution selected so as to have a higher etch rate towards the substrate than towards the resonator and a nonzero etch rate towards the resonator.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 14, 2022
    Inventors: Antoine Pacco, Massimo Mongillo, Anton Potocnik, Danny Wan, Jeroen Verjauw
  • Publication number: 20210104344
    Abstract: In one aspect, the disclosed technology relates to a magnetic device, which may be a magnetic memory and/or logic device. The magnetic device can comprise a seed layer; a first free magnetic layer provided on the seed layer; an interlayer provided on the first free magnetic layer; a second free magnetic layer provided on the interlayer; a tunnel barrier provided on the second free magnetic layer; and a fixed magnetic layer. The first free magnetic layer and the second free magnetic layer can be ferromagnetically coupled across the interlayer through exchange interaction.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 8, 2021
    Inventors: Van Dai Nguyen, Sebastien Couet, Olivier Bultynck, Danny Wan, Eline Raymenants