Patents by Inventor Danting FENG

Danting FENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure of power semiconductor module
    Patent number: 12205872
    Abstract: The invention discloses a novel packaging structure of a power semiconductor module, which mainly comprises an insulating radiating fin, a metal lead frame unit and a chip unit. The insulating radiating fin comprises an insulating layer, and an inner metal conducting layer and an outer metal conducting layer which are respectively arranged on two sides of the insulating layer; the metal lead frame unit mainly comprises a frame pin input portion, a frame pin output portion and a frame pin signal portion, the frame pin input portion is arranged on an upper side of the inner metal conducting layer in a solder welding mode, and the chip unit is welded to the middle of the inner metal conductive layer. The frame pin output portion is provided with an inner concave portion.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: January 21, 2025
    Assignee: STARPOWER SEMICONDUCTOR LTD.
    Inventors: Danting Feng, Junjun Fang
  • NOVEL PACKAGING STRUCTURE OF POWER SEMICONDUCTOR MODULE
    Publication number: 20240203841
    Abstract: The invention discloses a novel packaging structure of a power semiconductor module, which mainly comprises an insulating radiating fin, a metal lead frame unit and a chip unit. The insulating radiating fin comprises an insulating layer, and an inner metal conducting layer and an outer metal conducting layer which are respectively arranged on two sides of the insulating layer; the metal lead frame unit mainly comprises a frame pin input portion, a frame pin output portion and a frame pin signal portion, the frame pin input portion is arranged on an upper side of the inner metal conducting layer in a solder welding mode, and the chip unit is welded to the middle of the inner metal conductive layer. The frame pin output portion is provided with an inner concave portion.
    Type: Application
    Filed: May 27, 2022
    Publication date: June 20, 2024
    Inventors: Danting FENG, Junjun FANG