Patents by Inventor Danut Bogdan

Danut Bogdan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7679156
    Abstract: An optical module has a circuit carrier, a housed semiconductor element placed on the circuit carrier, and a lens unit for projecting electromagnetic radiation onto the semiconductor element. The lens unit, which is constructed separate from the cased semiconductor element, preferably comprises a lens assembly formed of, for example, three lenses and of a diaphragm. The three lenses, optionally together with the diaphragm, are aligned in a well-defined manner due to their geometric design so that no additional optical adjustment is necessary. According to the invention, a support is formed, at least in sections, on the case of the semiconductor element, and the lens unit is placed thereon thus being supported. The concept is that by forming a support directly on the case of a cased semiconductor element even with classically cased semiconductor chips, it is possible to construct a camera module with which every mechanical focus setting can be eliminated.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: March 16, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventors: Danut Bogdan, Josef Dirmeyer, Henryk Frenzel, Harald Schmidt
  • Patent number: 7570439
    Abstract: An optical module has a circuit carrier, a housed semiconductor element disposed on the circuit carrier, and a lens unit for projecting electromagnetic radiation onto the semiconductor element. The lens unit preferably includes a lens assembly with, say, three lenses and a diaphragm. The lenses, optionally together with the diaphragm, are aligned in a well-defined manner due to their geometric design so that no additional optical adjustment is necessary. The lenses are held in a type of lens holder that is an integral component of the housing of the semiconductor element.
    Type: Grant
    Filed: September 22, 2004
    Date of Patent: August 4, 2009
    Assignee: Siemens Aktiengesellschaft
    Inventors: Danut Bogdan, Josef Dirmeyer, Henryk Frenzel, Harald Schmidt
  • Publication number: 20070031137
    Abstract: An optical module has a circuit carrier, a housed semiconductor element disposed on the circuit carrier, and a lens unit for projecting electromagnetic radiation along an optical axis towards the semiconductor element. The housed semiconductor element and the lens unit are embodied as two components. At least one spacer element is disposed outside the optical axis, between the housing of the semiconductor element and the lens unit. Due to the addition of a low-cost spacer element, the invention enables the simple compensation of possible remaining work tolerances, for example between client-specific semiconductor housings and lens units selected from lines of products of different production quality. While tolerance-exceeding lines of products have not had any use until now as rejects, reliable camera modules can advantageously be assembled using a compensation element according to the invention, and in principle, any mechanical adjustment of the focal point can also be dispensed with.
    Type: Application
    Filed: September 15, 2004
    Publication date: February 8, 2007
    Applicant: Siemens AG
    Inventors: Danut Bogdan, Jozef Dimeyer, Henryk Frenzel, Harald Schmidt
  • Publication number: 20060239632
    Abstract: An optical module has a circuit carrier, a housed semiconductor element disposed on the circuit carrier, and a lens unit for projecting electromagnetic radiation onto the semiconductor element. The lens unit preferably includes a lens assembly with, say, three lenses and a diaphragm. The lenses, optionally together with the diaphragm, are aligned in a well-defined manner due to their geometric design so that no additional optical adjustment is necessary. The lenses are held in a type of lens holder that is an integral component of the housing of the semiconductor element.
    Type: Application
    Filed: September 22, 2004
    Publication date: October 26, 2006
    Inventors: Danut Bogdan, Josef Dirmeyer, Henryk Frenzel, Harald Schmidt
  • Publication number: 20060202293
    Abstract: An optical module has a circuit carrier, a housed semiconductor element placed on the circuit carrier, and a lens unit for projecting electromagnetic radiation onto the semiconductor element. The lens unit, which is constructed separate from the cased semiconductor element, preferably comprises a lens assembly formed of, for example, three lenses and of a diaphragm. The three lenses, optionally together with the diaphragm, are aligned in a well-defined manner due to their geometric design so that no additional optical adjustment is necessary. According to the invention, a support is formed, at least in sections, on the case of the semiconductor element, and the lens unit is placed thereon thus being supported. The concept is that by forming a support directly on the case of a cased semiconductor element even with classically cased semiconductor chips, it is possible to construct a camera module with which every mechanical focus setting can be eliminated.
    Type: Application
    Filed: September 14, 2004
    Publication date: September 14, 2006
    Inventors: Danut Bogdan, Josef Dirmeyer, Henryk Frenzel, Harald Schmidt