Abstract: A light-emitting device includes a light-emitting assembly, a first adhesive film, and a second adhesive film. The light-emitting assembly includes a first PCB substrate, a first light-emitting chip, and second light-emitting chips. The first PCB substrate has a mounting surface on one side of the first PCB substrate. The first light-emitting chip and the second light-emitting chips are disposed on the mounting surface. The light emission angle of the first light-emitting chip is less than the light emission angle of each of the second light-emitting chips. The first adhesive film is disposed on the mounting surface. The first adhesive film covers the first light-emitting chip. The second adhesive film covers the second light-emitting chip. The second adhesive film covers and is connected to the light-emitting assembly and the first adhesive film. The refractive index of the first adhesive film is greater than the refractive index of the second adhesive film.

Abstract: Provided are a method for machining a device and the device. The method for machining a device includes die bonding, primary dicing, filling by a baffle wall material, grinding and secondary dicing. In the step of grinding machining, a semi-finished product is placed on a platform surface of a grinding and fixing platform, a grinding working end of a grinding device is controlled to operate, and with the platform surface of the grinding and fixing platform as a height reference, the grinding working end grinds from above the semi-finished product toward the grinding and fixing platform and operates to a preset height. Through the special machining process, the probability of the appearance of white glue on a top surface of the device is reduced, which is conducive to ensuring a production yield of the device.

Abstract: Provided are a bracket and a LED device. The bracket includes a lead frame and a molded structure connected to the lead frame. The lead frame includes a first lead portion, a second lead portion, and a barrier structure. The first lead portion includes a first base. The second lead portion includes a second base spaced from the first base. A gap between the first base and the second base forms a channel. The barrier structure is disposed on a side of at least one of the first base or the second base facing the channel. The barrier structure is disposed between two opposite ends of the first base and/or the second base and protrudes from the first base and/or the second base, and a length between two opposite ends of the channel is greater than a length of a middle part so that a “wide-narrow-wide” pattern is formed.

Abstract: A method for die bonding an LED chip includes S1: forming a preset adhesive droplet array corresponding to one pad on a substrate based on the area S of one LED chip and the radius R of an adhesive droplet formed by a dispensing device in a single dispensing action, where parameters of the preset adhesive droplet array include the number X of adhesive droplets in a horizontal direction, the number Y of adhesive droplets in a vertical direction, and a horizontal distance H between two horizontally adjacent adhesive droplets, and a vertical distance D between two vertically adjacent adhesive droplets; S2: dispensing a conductive adhesive onto the pad multiple times according to the preset adhesive droplet array to form a bonding portion; and S3: placing the LED chip on the bonding portion and curing the conductive adhesive.

Abstract: A light-emitting module includes a lead frame, a substrate, a light-emitting element, a plastic encapsulation body, a driver IC chip and multiple passive devices. The substrate is disposed on the lead frame, and the light-emitting element, the driver IC chip and the multiple passive devices are disposed on the substrate. The substrate is a double-sided metal-plated insulated substrate. The plastic encapsulation body at least covers part of the lead frame, and a light condensation cavity is disposed in the plastic encapsulation body and covers above the light-emitting element. Circuit wires are further etched on the substrate, and the light-emitting element, the driver IC chip and the multiple passive devices are correspondingly connected based on the circuit wires.

Abstract: A light-emitting device includes a light-emitting assembly and a light-transmissive component. The light-emitting assembly includes a first bracket, a light-emitting element, and a first photosensitive element. The first bracket has a first surface and a second surface opposite to each other. Multiple first electrodes and multiple second electrodes are disposed at intervals on the first surface, and the light-emitting element and the first photosensitive element are disposed at intervals on the second surface. The light-emitting element is electrically connected to at least one of the multiple first electrodes. The first photosensitive element is electrically connected to at least one of the multiple second electrodes.

Abstract: An ultraviolet LED device includes a holder and a lens. The holder is provided with an accommodation cavity. The lens is configured to seal the accommodation cavity. A chip is disposed at a cavity bottom of the accommodation cavity. The accommodation cavity is filled with a Si—O main chain polymer. The holder is provided with at least one through hole. The at least one through hole is located at the bottom of the holder and communicates with the accommodation cavity. A sealing member is disposed in each of the at least one through hole.

Abstract: Provided is an LED support. The LED support includes a substrate, an inner electrode, a heat dissipation pad, an electrode pad, and a solder resist layer. The electrode pad includes a top connection layer and a bottom electrode layer that are laminated. The top connection layer is connected to the back of the substrate and is provided with a connection portion extending toward the heat dissipation pad and connected to the conductive through hole in the substrate. The connection portion is between the heat dissipation pad and the bottom electrode layer. The spacing between the bottom electrode layer and the heat dissipation pad is greater than the spacing between the connection portion and the heat dissipation pad. The solder resist layer is filled in a groove formed between the electrode pad and the heat dissipation pad on the back of the substrate, and covers the connection portion.

Abstract: Provided are an LED package device and a preparation method thereof, and a display device. The package device includes a transparent substrate, a black layer, a transparent bonding layer, multiple LED chips, and a mold protective layer. The multiple LED chips are fixed to the transparent substrate based on the transparent bonding layer. The black layer is configured to cover the transparent bonding layer. The black layer is provided with multiple matching holes. The multiple LED chips are matched in the multiple matching holes in a one-to-one correspondence. The cover area of the transparent bonding layer is S1. The area of the top surface of the transparent substrate is S2. The constraint relationship between S1 and S2 is S1<S2. The mold protective layer is configured to wrap the black layer, the transparent bonding layer, and the multiple LED chips on the transparent substrate.

Abstract: Provided are a bracket and a LED device. The bracket includes a lead frame and a molded structure connected to the lead frame. The lead frame includes a first lead portion, a second lead portion, and a barrier structure. The first lead portion includes a first base. The second lead portion includes a second base spaced from the first base. A gap between the first base and the second base forms a channel. The barrier structure is disposed on a side of at least one of the first base or the second base facing the channel. The barrier structure is disposed between two opposite ends of the first base and/or the second base and protrudes from the first base and/or the second base, and a length between two opposite ends of the channel is greater than a length of a middle part so that a “wide-narrow-wide” pattern is formed.

Abstract: Provided are a method for machining a device and the device. The method for machining a device includes die bonding, primary dicing, filling by a baffle wall material, grinding and secondary dicing. In the step of grinding machining, a semi-finished product is placed on a platform surface of a grinding and fixing platform, a grinding working end of a grinding device is controlled to operate, and with the platform surface of the grinding and fixing platform as a height reference, the grinding working end grinds from above the semi-finished product toward the grinding and fixing platform and operates to a preset height. Through the special machining process, the probability of the appearance of white glue on a top surface of the device is reduced, which is conducive to ensuring a production yield of the device.

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N?2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m?2, n?2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N?2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m?2, n?2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.

Abstract: Provided are an LED holder, an LED device and an LED display screen. The LED holder includes a metal frame and a cup cover wrapping the metal frame. The cup cover includes a reflective cup. The cup cover has a first lateral surface and a second lateral surface disposed opposite to each other. A height of the first lateral surface is greater than a height of the second lateral surface. The metal frame includes metal pins exposed outside the cup cover and disposed on the first lateral surface and/or the second lateral surface. The bottom of the cup cover is of a sloping structure, so that the light emitted by an LED chip in the reflective cup propagates along a specified direction.

Abstract: Provided are an LED holder, an LED device and an LED display screen. The LED holder includes a metal frame and a cup cover wrapping the metal frame. The cup cover includes a reflective cup. The cup cover has a first lateral surface and a second lateral surface disposed opposite to each other. A height of the first lateral surface is greater than a height of the second lateral surface. The metal frame includes metal pins exposed outside the cup cover and disposed on the first lateral surface and/or the second lateral surface. The bottom of the cup cover is of a sloping structure, so that the light emitted by an LED chip in the reflective cup propagates along a specified direction.