Patents by Inventor Dany Kim

Dany Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe card inspection wafer, probe card inspection system, and method of inspecting probe card
    Patent number: 11067658
    Abstract: A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: July 20, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joon-su Ji, Dany Kim, Han-jik Nam, Jin-woo Jung
  • PROBE CARD INSPECTION WAFER, PROBE CARD INSPECTION SYSTEM, AND METHOD OF INSPECTING PROBE CARD
    Publication number: 20200088827
    Abstract: A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.
    Type: Application
    Filed: March 15, 2019
    Publication date: March 19, 2020
    Inventors: Joon-su Ji, Dany Kim, Han-jik Nam, Jin-woo Jung