Patents by Inventor Dany Lemay

Dany Lemay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100005746
    Abstract: The present invention describes a prefab wall structure which provides a reduced thermal conductivity. More particularly, the prefac wall structure comprises a stud assembly made of at least two studs secured one to the other through a contact surface lateral to said stud. This reduces the conductivity of the temperature exchange throughout the wall.
    Type: Application
    Filed: July 10, 2008
    Publication date: January 14, 2010
    Inventor: Dany Lemay