Abstract: A fiber transition apparatus is used to transition optical fiber between multiple levels of components in fiber optic equipment. The fiber transition apparatus comprises a helical fiber holding member having a fiber passage for receiving the optical fiber and a shape and dimension to maintain a critical bend radius of the optical fiber. The fiber holding member passes through at least two levels of electronic components, such as two printed wiring boards (PWBs). Optical fiber passes into and out of the fiber holding member at each of the levels. One embodiment of the fiber holding member includes a slot that allows the fibers to pass into and out of the fiber holding member. The fiber holding member is preferably mounted to at least one of the PWBs, for example, using mounting members attached at each end of the fiber holding member.

Abstract: An optical fiber oven encloses optical fibers, such as erbium doped fibers, and maintains an optimal temperature range for the fibers. The optical fiber oven includes a housing having fiber entrance holes and fiber exit holes allowing the fiber to enter and exit the housing. The fibers are positioned around a fiber hub within the housing to maintain the minimum bend radius of the optic fiber. A heating element and heat regulation device are mounted within the housing to maintain the optimal temperature.

Abstract: An EMC sealed joint is used within electronic equipment to provide compliance with electromagnetic compatibility (EMC) standards. In one example, EMC sealed joints are used with faceplates mounted to printed wiring boards stacked side by side in an electronic equipment rack, for example, to seal the adjacent faceplates against one another and to seal the faceplates to the shelf edge portions in the rack. One type of EMC sealed joint is formed by a concave groove in a side portion of the faceplate, which receives an EMC gasket located on an adjacent faceplate. Another type of EMC sealed joint is formed by protrusions on a back surface of the front portion of the faceplate, which engage a flat surface on a shelf edge portion in the electronic equipment rack.

Abstract: A heat sink used in an electronic assembly includes mounting surfaces on a first side of a base portion and extended heat dissipating surfaces (e.g., fins) extending from a second side of the base portion. One or more electronic component boards, such as printed wiring boards (PWBs), are mounted to the mounting surfaces on the heat sink at one or more levels. Some of the mounting surfaces can be formed on mounting ridges, which define channels. Ventilation apertures located between the fins extend through the base portion such that air is drawn through the channels and up through the apertures creating a “chimney” effect. The heat sink is also grounded to at least one of the PWBS and electrically isolated from the chassis. Isolator bushings can be mounted in one or more of the fins for receiving pins extending from the chassis to insure mechanical support and isolation/dampening and to insure electrical isolation from the chassis.

Abstract: An electromagnetic shield assembly for an optical fiber connector which comprises a conductive frame member enclosing an open space and a plurality of conductive fibers each secured at only one end to the frame member and extending into the open space. The free ends of the conductive fibers overlap in a central region of the open space to provide a “self-healing” mesh shield.

Abstract: A bridging apparatus facilitates communication between processors across networks having incompatible protocols and linking the processors. The bridging apparatus interfaces each processor to a respective incompatible network, and processes data in two-way communication across the interfaces for conversion from one incompatible protocol to another.