Patents by Inventor Dany Mazliah

Dany Mazliah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mounted chip resistor with flexible leads
    Patent number: 8325005
    Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: December 4, 2012
    Assignee: Vishay International, Ltd.
    Inventors: Joseph Szwarc, Dany Mazliah, Makio Sato, Toru Okamoto
  • SURFACE MOUNTED CHIP RESISTOR WITH FLEXIBLE LEADS
    Publication number: 20110241819
    Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.
    Type: Application
    Filed: June 20, 2011
    Publication date: October 6, 2011
    Applicant: VISHAY INTERNATIONAL, LTD.
    Inventors: Joseph Szwarc, Dany Mazliah, Makio Sato, Toru Okamoto
  • Surface mounted chip resistor with flexible leads
    Patent number: 7965169
    Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: June 21, 2011
    Inventors: Joseph Szwarc, Dany Mazliah, Makio Sato, Toru Okamoto
  • SURFACE MOUNTED CHIP RESISTOR WITH FLEXIBLE LEADS
    Publication number: 20090212900
    Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.
    Type: Application
    Filed: February 22, 2008
    Publication date: August 27, 2009
    Applicant: VISHAY INTERTECHNOLOGY, LTD.
    Inventors: JOSEPH SZWARC, DANY MAZLIAH, MAKIO SATO, TORU OKAMOTO