Patents by Inventor Dany Quahs

Dany Quahs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed Circuit Board Assembly of an Implantable Medical Device
    Publication number: 20210410287
    Abstract: A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.
    Type: Application
    Filed: September 10, 2021
    Publication date: December 30, 2021
    Applicant: BIOTRONIK SE & Co. KG
    Inventors: Roman Meier, Dany Quahs, Jan Romberg
  • Printed circuit board assembly of an implantable medical device
    Patent number: 11147164
    Abstract: A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: October 12, 2021
    Assignee: BIOTRONIK SE & Co. KG
    Inventors: Roman Meier, Dany Quahs, Jan Romberg
  • Printed Circuit Board Assembly of an Implantable Medical Device
    Publication number: 20210092849
    Abstract: A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.
    Type: Application
    Filed: September 11, 2020
    Publication date: March 25, 2021
    Inventors: Roman Meier, Dany Quahs, Jan Romberg