Abstract: This application discloses a MEMS chip structure, including a substrate, a side wall, a dielectric plate, a MEMS micromirror array, and a grid array, where the MEMS micromirror array includes a plurality of grooves and a plurality of MEMS micromirrors. The plurality of MEMS micromirrors are in a one-to-one correspondence with the plurality of grooves. The grid array is located above the MEMS micromirror array, and a lower surface of the grid array is connected to upper surfaces of side walls of at least some of the plurality of grooves.

Abstract: This application discloses example piezoelectric acoustic sensors and methods for manufacturing the piezoelectric acoustic sensor, and belongs to the field of electronic technologies. In one example, the piezoelectric acoustic sensor includes an anchoring unit, a piezoelectric unit, a support unit, and a hollow-out mechanical part. A back cavity is formed in the anchoring unit. The piezoelectric unit is configured to convert a sound signal that enters the back cavity into an electrical signal. The support unit covers the anchoring unit and the piezoelectric unit. The hollow-out mechanical part is connected between the anchoring unit and the piezoelectric unit, and is embedded in the support unit.

Abstract: A piezoelectric MEMS sensor and a related device is disclosed, applied to scenarios such as a terminal, a smart acoustic system, a wireless Bluetooth headset, an active noise reduction headset, a notebook computer, and an automobile industry, including a substrate including a sound entry channel and at least one cantilever. The cantilever includes a first region and a second region that are connected to each other. The first region includes a first side face and a second side face, the first side face is a side face that is of the first region and that faces a target face, and the target face is a face that is of the cantilever and that is connected to the substrate. An included angle between the first side face and the second side face is greater than or equal to 90 degrees and less than 180 degrees.

Abstract: This application discloses a MEMS chip structure, including a substrate, a side wall, a dielectric plate, a MEMS micromirror array, and a grid array, where the MEMS micromirror array includes a plurality of grooves and a plurality of MEMS micromirrors. The plurality of MEMS micromirrors are in a one-to-one correspondence with the plurality of grooves. The grid array is located above the MEMS micromirror array, and a lower surface of the grid array is connected to upper surfaces of side walls of at least some of the plurality of grooves.

Abstract: A micromirror structure includes an outer frame, an inner frame, a lens, a pair of first hinges, a pair of second hinges, a first driver module, and a second driver module. The pair of first hinges is respectively connected between two ends of the lens and an inner wall of the inner frame, and a connection line of the pair of first hinges forms a first rotation axis. The pair of second hinges is respectively connected between an outer wall of the inner frame and an inner wall of the outer frame, a connection line of the pair of second hinges forms a second rotation axis, and the first rotation axis is perpendicular to the second rotation axis. The micromirror structure can ensure that the lens is precisely positioned in a rotation process.

Abstract: A micromirror unit, comprising a mirror and a drive apparatus. A side of the mirror facing the drive apparatus is provided with a support post. The drive apparatus comprises a supporting frame, an rotation block fixedly connected to the supporting post, and a plurality of piezoelectric drive arms provided along a peripheral edge of the rotation block. An end of each of the piezoelectric drive arms is fixed on the supporting frame, and another end thereof is connected to the rotation block via an elastic member provided between the other end and the rotation block. The piezoelectric drive arm comprises an upper electrode, a lower electrode, and a piezoelectric material clamped between the upper electrode and the lower electrode.