Patents by Inventor Danying LI

Danying LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240037897
    Abstract: An apparatus and method of feature extraction for identifying a pattern. An improved method includes obtaining data representative of a pattern instance, dividing the pattern instance into a plurality of zones, determining a representative characteristic of a zone of the plurality of zones, generating a representation of the pattern instance using a feature vector, wherein the feature vector includes an element corresponding to the representative characteristic, wherein the representative characteristic is indicative of a spatial distribution of one or more features of the zone. The method may also include classifying and/or selecting pattern instances based on the feature vector.
    Type: Application
    Filed: November 24, 2021
    Publication date: February 1, 2024
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Danying LI, Meng LIU, Jen-Yi WUU, Rencheng SUN, Cong WU, Dean XU
  • Patent number: 11281113
    Abstract: A method for determining a stack configuration for a substrate subjected to a patterning process. The method includes obtaining (i) measurement data of a stack configuration with location information on a printed substrate, (ii) a substrate model configured to predict a stack characteristic based on a location of the substrate, and (iii) a stack map including a plurality of stack configurations based on the substrate model. The method iteratively determines values of model parameters of the substrate model based on a fitting between the measurement data and the plurality of stack configurations of the stack map, and predicts an optimum stack configuration at a particular location based on the substrate model using the values of the model parameters.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: March 22, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Danying Li, Chi-Hsiang Fan, Abdalmohsen Elmalk, Youping Zhang, Jay Jianhui Chen, Kui-Jun Huang
  • Publication number: 20210247701
    Abstract: A method for determining a stack configuration for a substrate subjected to a patterning process. The method includes obtaining (i) measurement data of a stack configuration with location information on a printed substrate, (ii) a substrate model configured to predict a stack characteristic based on a location of the substrate, and (iii) a stack map including a plurality of stack configurations based on the substrate model. The method iteratively determines values of model parameters of the substrate model based on a fitting between the measurement data and the plurality of stack configurations of the stack map, and predicts an optimum stack configuration at a particular location based on the substrate model using the values of the model parameters.
    Type: Application
    Filed: May 21, 2019
    Publication date: August 12, 2021
    Applicant: ASMI NETHERLANDS B.V.
    Inventors: Danying LI, Chi-Hsiang FAN, Adbalmohsen ELMALK, Youping ZHANG, Jay Jianhui CHEN, Kui-Jun HUANG