Abstract: A power module having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The inductor assembly has a first winding, a second winding, a first magnetic core part and a second magnetic core part. The first magnetic core part has a first portion disposed on a first horizontal level and a second portion disposed on a second horizontal level. The second magnetic core part has a first portion disposed on the second horizontal level and a second portion disposed on the first horizontal level. The first and second magnetic core parts are assembled to accommodate the first winding between the first portions of the first and second magnetic core part, and to accommodate the second winding between the second portions of the first and second magnetic core part.

Abstract: A power module, having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The device substrate having a first power device chip and a second power device chip embedded within the device substrate. Each power device chip has a first surface and a second surface. The first surface of each power device chip is covered by a top heat layer, and the second surface of each power device chip has a plurality of pins or pads exposed on the second surface of the device substrate, and connected to the bottom substrate.

Abstract: A power module has an inductor assembly and a device substrate. The inductor assembly comprises a magnetic core, a first winding and a second winding. Each of the first winding and the second winding has a first end and a second end exposed at the second surface of the inductor assembly. The device substrate has a first power device chip and a second power device chip at least partially embedded within the device substrate. The device substrate further has a first top heat layer at least partially covering the first power device chip and a second top heat layer at least partially covering the second power device chip. The first end of the first winding is electrically connected to the first top heat layer, and the first end of the second winding is electrically connected to the second top heat layer.

Abstract: A power module, having: a transformer pack; a top substrate mounted on the transformer pack; and two power device chips mounted on the top substrate, wherein each one of the power device chips has at least one pin connected to the transformer pack via the top substrate; wherein the transformer pack has a magnetic core, a first primary winding and a second primary winding, a first secondary winding and a second secondary winding, a first magnetic core part and a second magnetic core part, and wherein each one of the primary windings passes through the magnetic core, the first secondary winding is close to the first primary winding with the first magnetic core part in between, and the second secondary winding is close to the second primary winding with the second magnetic core part in between.

Abstract: A power module includes a substrate and an integrated circuit (IC) die. The IC die is disposed on the substrate. A driver and a pair of switches are integrated in the IC die. A power converter of the power module includes the driver, the pair of switches, an inductor, and a capacitor. The inductor and the capacitor are embedded within the substrate.

Abstract: A power module has a printed circuit board (PCB) having an output inductor substrate layer and an output capacitor substrate layer. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on a surface of the power module. Output voltages of the power converters are provided at output voltage nodes. The power converters include output inductors that are embedded within the output inductor substrate layer and output capacitors that are embedded within the output capacitor substrate layer. Embedded output inductors and capacitors are connected to corresponding output voltage nodes.

Abstract: A power module has a substrate with a bottom side and a component side. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on the component side of the substrate. The power converters include output inductors that are disposed within the substrate. An end of an output inductor is connected to a switch node of a monolithic IC switch block and another end of the output inductor is connected to an output voltage node of the power module.

Abstract: A resonant converter has a primary resonant tank circuit and a secondary resonant tank circuit. An inverter circuit converts an input DC voltage received by the resonant converter at an input voltage node to a pulsating signal that is fed to the primary resonant tank circuit to generate a resonant tank current that flows through a primary winding of a transformer. The resonant tank current induces current in a secondary winding of the transformer. The induced current is rectified by a rectifier and the rectified signal is filtered to generate an output DC voltage at an output voltage node. The secondary resonant tank circuit is disposed between the secondary winding of the transformer and the output voltage node, and a tank node of the secondary resonant tank is connected to the primary resonant tank circuit through the inverter circuit.

Abstract: A multiphase converter provides an output voltage to a load. The multiphase converter receives a load event signal from the load and turns ON at a same time the phases of the multiphase converter to increase the output voltage in response to the load event signal indicating that a load current drawn by the load from the multiphase converter is about to increase. The multiphase converter increases an impedance of low-side switches of the multiphase converter in response to the load event signal indicating that the load current is about to decrease.

Abstract: A power module includes a first power module and a second power module arranged below the first power module. The first power module includes at least one input pad configured to receive an input voltage and at least one power pad configured to provide an intermediate voltage. The at least one input pad is mounted on a top surface of the first power module, and the at least one power pad is mounted on a bottom surface of the first power module. The second power module includes at least one signal pad configured to receive the intermediate voltage and at least one output pad configured to provide an output voltage. The at least one signal pad is mounted on a top surface of the second power module, and the at least one output pad is mounted on a bottom surface of the second power module.

Abstract: A controller for a multiphase switching converter has a feedback pin, a reference pin, and a plurality of switching control pins. When the controller is a master controller, the reference pin provides a reference output signal based on a plurality of currents flowing through a plurality of switching circuits. When the controller is a slave controller, the feedback pin receives the reference output signal from the master controller, and the slave controller provides the plurality of switching control signals based on the plurality of currents flowing through the plurality of switching circuits, the reference output signal, and a feedback signal representative of an output voltage of the multiphase switching converter.

Abstract: A controller for a multiphase switching converter has a logic circuit, to provide a plurality of switching control signals to control the plurality of switching circuits. When as a master controller, the controller provides a first total current signal based on a sum of a plurality of currents flowing through the plurality of switching circuits. When as a slave controller, the controller receives the first total current signal, provides a second total current signal based on the sum of the plurality of currents flowing through the plurality of switching circuits, and turns on the plurality of switching circuits in sequence based on the first total current signal and the second total current signal.

Abstract: A power module has a substrate, a magnetic component disposed on the substrate, a plurality of power integrated circuits (ICs), and a heat spreader. The heat spreader and at least a part of the plurality of power ICs are disposed on a top surface of the substrate. The heat spreader is fixed on the substrate through a structural adhesive, covering top surfaces of the part of the plurality of power ICs on the top surface of the substrate, and is in contact with the top surfaces of the part of the plurality of power ICs on the top surface of the substrate through a thermal conductive adhesive. A difference between a height measured from a topmost surface of the magnetic component to the top surface of the substrate and a height measured from a topmost surface of the heat spreader to the top surface of the substrate is within 300 um.

Abstract: A resonant converter has a primary resonant tank circuit and a secondary resonant tank circuit. An inverter circuit converts an input DC voltage received by the resonant converter at an input voltage node to a pulsating signal that is fed to the primary resonant tank circuit to generate a resonant tank current that flows through a primary winding of a transformer. The resonant tank current induces current in a secondary winding of the transformer. The induced current is rectified by a rectifier and the rectified signal is filtered to generate an output DC voltage at an output voltage node. The secondary resonant tank circuit is disposed between the secondary winding of the transformer and the output voltage node, and a tank node of the secondary resonant tank is connected to the primary resonant tank circuit through the inverter circuit.

Abstract: A resonant converter has a primary resonant tank circuit and a secondary resonant tank circuit. An inverter circuit converts an input DC voltage received by the resonant converter at an input voltage node to a pulsating signal that is fed to the primary resonant tank circuit to generate a resonant tank current that flows through a primary winding of a transformer. The resonant tank current induces current in a secondary winding of the transformer. The induced current is rectified by a rectifier and the rectified signal is filtered by an output capacitor to generate an output DC voltage at an output voltage node. The secondary resonant tank circuit is disposed between the input voltage node and the output voltage node to inject odd order harmonics of the operating frequency to the primary tank circuit to shape the resonant tank current.

Abstract: A power supply module comprises an inductor pack, a top PCB (Printed Circuit Board) on top of the inductor pack, a bottom PCB disposed below the inductor pack, a connector connected between the bottom PCB and the top PCB, two power device chips on top of the top PCB, an output capacitor substrate layer disposed below the bottom PCB, and an interposer substrate layer disposed below the output capacitor substrate layer. The inductor pack comprises two inductors, each inductor having a first end and a second end. The two power device chips are respectively connected to the first ends of the two inductors via the top PCB. A first output capacitor and a second output capacitor are embedded within the output capacitor substrate layer, and are respectively connected to the second ends of the two inductors to provide a first output voltage and a second output voltage.

Abstract: A multiphase converter provides an output voltage to a load. The multiphase converter receives a load event signal from the load and turns ON at a same time the phases of the multiphase converter to increase the output voltage in response to the load event signal indicating that a load current drawn by the load from the multiphase converter is about to increase. The multiphase converter increases an impedance of low-side switches of the multiphase converter in response to the load event signal indicating that the load current is about to decrease.

Abstract: A hybrid DC-DC converter includes a converter circuit, a bridge circuit with a bridge path that includes a winding of a transformer, and another bridge circuit with a bridge path that includes another winding of the transformer. Current through the bridge path of the other bridge circuit flows through the converter circuit in one direction and bypasses the converter circuit in the other direction. The converter circuit can operate in buck, boost, or buck-boost mode.

Abstract: A power module has a printed circuit board (PCB) having an output inductor substrate layer and an output capacitor substrate layer. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on a surface of the power module. Output voltages of the power converters are provided at output voltage nodes. The power converters include output inductors that are embedded within the output inductor substrate layer and output capacitors that are embedded within the output capacitor substrate layer. Embedded output inductors and capacitors are connected to corresponding output voltage nodes.

Abstract: A power module has a substrate with a bottom side and a component side. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on the component side of the substrate. The power converters include output inductors that are disposed within the substrate. An end of an output inductor is connected to a switch node of a monolithic IC switch block and another end of the output inductor is connected to an output voltage node of the power module.