Abstract: A method for manufacturing a package structure is provided. The method includes providing a package structure including a first region and a second region different from the first region, wherein the package structure comprises a package substrate having an active surface and a backside surface; and irradiating the package structure by a first light beam along a first direction from the active surface toward the backside surface, wherein the first light beam only irradiates the first region without irradiating the second region.

Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.

Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.

Abstract: A cross primer isothermal amplification primer set for detecting tobacco ringspot virus, a kit and application thereof are provided. The kit and the method provided by the disclosure have good specificity and negative reaction to quarantine viruses such as southern bean mosaic virus, tomato ringspot virus, Arabidopsis mosaic virus, bean pod mottle virus and the like. The real-time fluorescence detection method has high sensitivity and can detect the RNA template of the tobacco ringspot virus with the minimum concentration of 5 ng/?L. The lowest detectable concentration of RNA template was 0.5 ng/?L. It is very suitable for on-site detection of medical and health, food safety and import and export quarantine, and is easy to be popularized and applied in a wide range.

Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.

Abstract: A method, apparatus, device, and storage medium for performing an action in a virtual environment are provided. The method comprises: in response to a target object being triggered to perform a target action in the virtual environment, presenting a description information associated with the target action in a first region, the description information indicating a probability event associated with the target action and a target value corresponding to the probability event; presenting, in a second region, an execution value associated with the probability event using a dynamic change of a probability interaction element, the second region being associated with a position of the target object; and controlling the target action to be performed in the virtual environment, wherein a triggering result of the probability event associated with the target action is determined based on a comparison between the execution value and the target value.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: The present disclosure discloses a method for making an ice surface of an ice rink and an ice rink including the ice surface. In the method, a salt solution is applied to an ice surface. The salt solution contains anions. A concentration of the anions is in a range from about 0.63 mmol/L to about 10 mmol/L. The anions in the salt solution are selected from the group consisting of chloride ions, nitrate ions, bromide ions, iodide ions, chlorate ions, perchlorate ions, thiocyanate ions, and any combination thereof. The ice surface is maintained at a temperature of about ?4° C. to about 14° C. to naturally freeze the salt solution.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: A network device includes a linear feedback shift register circuit and a value updating circuit. The linear feedback shift register circuit is configured to perform an auto crossover mechanism according to at least one clock signal and a plurality of first bits, in order to control at least one port of a first interface circuit to connect with a second interface circuit. The value updating circuit is configured to perform at least one of a plurality of operations according to exclusive information. The plurality of operations includes: generating a plurality of initial values, in which the value updating circuit is configured to utilize the plurality of initial values to update at least one partial bits of the plurality of first bits; or setting a period of the at least one clock signal, in which the exclusive information includes operational information or production information of the network device.

Abstract: A network device includes a linear feedback shift register circuit and a value updating circuit. The linear feedback shift register circuit is configured to perform an auto crossover mechanism according to at least one clock signal and a plurality of first bits, in order to control at least one port of a first interface circuit to connect with a second interface circuit. The value updating circuit is configured to perform at least one of a plurality of operations according to exclusive information. The plurality of operations includes: generating a plurality of initial values, in which the value updating circuit is configured to utilize the plurality initial values to update at least one partial bits of the plurality of first bits; or setting a period of the at least one clock signal, in which the exclusive information includes operational information or production information of the network device.

Abstract: The invention is based on the discovery that injectable and nucleic acid-compatible polymeric compositions and formulations can be structurally designed to regulate nucleic acid activity or gene expression in vivo, for example, by controlling the bioavailability of the nucleic acid via modulation of the biodegradability and crosslink density of the network formed by the components of the formulation. The polymeric network encases the nucleic acid, not only controlling the release of the DNA, but also providing protection from degradation. The invention described herein improves upon prior modes of gene delivery, in that gene expression can be regulated by modulation of a polymeric network formed by combination of at least two water-soluble components capable of reacting with one another. The nucleic acid of interest is incorporated into the network to be released in a sustained manner to achieve level and duration of activity or expression needed.