Patents by Inventor Daoke YU

Daoke YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11325210
    Abstract: A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: May 10, 2022
    Assignee: Shenzhen Fitech Co., Ltd.
    Inventors: Pu Xu, Siyuan Wang, Daoke Yu, Kui Chen, Jianhao Shi
  • Publication number: 20200001406
    Abstract: A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C.
    Type: Application
    Filed: December 7, 2017
    Publication date: January 2, 2020
    Applicant: Shenzhen Fitech Co., Ltd.
    Inventors: Pu XU, Siyuan WANG, Daoke YU, Kui CHEN, Jainhao SHI