Patents by Inventor Daopeng WANG

Daopeng WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Layered structures with cutting lines
    Patent number: 12086666
    Abstract: The invention is related to a layered structure with at least one layer a. of a material with a VST?85° C. comprising at least one cutting line b. reaching through the whole thickness of the layered structure surrounding at least one first portion which is extractable and reinsertable manually from the layered structure as well as a production process for such a layered structure.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: September 10, 2024
    Assignees: Covestro Deutschland AG, Covestro Intellectual Property GmbH & Co. KG
    Inventors: Heinz Pudleiner, Georgios Tziovaras, Kira Planken, Stefan Janke, Christoph Koehler, Roland Kuenzel, Daopeng Wang, Meng Feng, Yizhe Zhao
  • LAYERED STRUCTURES WITH CUTTING LINES
    Publication number: 20230025063
    Abstract: The invention is related to a layered structure with at least one layer a. of a material with a VST?85° C. comprising at least one cutting line b. reaching through the whole thickness of the layered structure surrounding at least one first portion which is extractable and reinsertable manually from the layered structure as well as a production process for such a layered structure.
    Type: Application
    Filed: December 10, 2020
    Publication date: January 26, 2023
    Inventors: Heinz PUDLEINER, Georgios TZIOVARAS, Kira PLANKEN, Stefan JANKE, Christoph KOEHLER, Roland KUENZEL, Daopeng WANG, Meng FENG, Yizhe ZHAO