Patents by Inventor Daoqiang (Daniel) Lu

Daoqiang (Daniel) Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate with lossy material insert
    Patent number: 7714430
    Abstract: In one embodiment, the present invention includes a semiconductor package with lossy material inserts. The lossy material inserts may reduce electronic noise such as package resonance. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: May 11, 2010
    Assignee: Intel Corporation
    Inventors: Xiang Yin Zeng, Daoqiang (Daniel) Lu, Jiangqi He, Jiamiao(John) Tang
  • Integrating electrical layer on optical sub-assembly for optical interconnects
    Publication number: 20080205816
    Abstract: Briefly, in accordance with one or more embodiments, an optical/electrical interconnect may comprise an optical/electrical assembly having a flex panel formed thereon. The flex panel may include one or more electrical traces and/or contact pads to couple electrical traces on a substrate of the optical/electrical interconnect with an optoelectronic die disposed on the optical/electrical assembly. The flex panel may be formed on a molded sub-assembly panel via lamination, or the sub-assembly panel may be formed on the flex panel via an over-molding process, to form laminated sub-assembly panels. The laminated sub-assembly panels may be diced into one or more optical/electrical assemblies.
    Type: Application
    Filed: February 26, 2007
    Publication date: August 28, 2008
    Inventors: Daoqiang (Daniel) Lu, Edris M. Mohammed
  • Substrate with lossy material insert
    Publication number: 20080102565
    Abstract: In one embodiment, the present invention includes a semiconductor package with lossy material inserts. The lossy material inserts may reduce electronic noise such as package resonance. Other embodiments are described and claimed.
    Type: Application
    Filed: September 28, 2006
    Publication date: May 1, 2008
    Inventors: Xiang Yin Zeng, Daoqiang (Daniel) Lu, Jiangqi He, Jiamiao (John) Tang