Abstract: Disclosed in the present disclosure is a metal structural member used in cooperation with a gallium-based liquid metal. A high phosphorus nickel alloy layer is arranged on a surface of the metal structural member in contact with the gallium-based liquid metal. The metal structural member does not react with the gallium-based liquid metal when it is in contact with the gallium-based liquid metal, thereby avoiding a degradation of heat dissipation performance due to consumption of the gallium-based liquid metal. Further disclosed in the present disclosure are a manufacturing method for the metal structural member, and an application of the metal structural member in heat dissipation of computer chips, cell phone chips, communication products, high power LEDs, insulated gate bipolar transistors, and high power electronic products.