Abstract: Provided is a low-pressure chip packaging type junction box for a solar power generation assembly and a processing method thereof, and more particularly, relates to a low-pressure chip packaging type junction box for a solar power generation assembly integrating techniques relating to development and manufacturing of junction boxes with semiconductor packaging techniques to increase a degree of product automation and a processing method thereof. The low-pressure chip packaging type junction box for a solar power generation assembly comprises a box body, N chips, N connection members, and N+1 copper conductors, where N?1. At least one accommodation recess is arranged at the box body. The box body is provided with a transverse bar. Chip installation positions are arranged at N copper conductors. The N+1 copper conductors are provided with lead-out positions positioned at a top surface of the transverse bar. The chip is welded and fixed to the installation position at the copper conductor.

Abstract: Provided is a photovoltaic connector, including a cathode photovoltaic connector and an anode photovoltaic connector; the cathode photovoltaic connector includes a cathode terminal block, a cathode conductive pin, a cathode cable and a cathode soft rubber base; the anode photovoltaic connector includes an anode terminal block, an anode conductive casing, an anode cable and an anode soft rubber base. The use of embodiments of the present invention can effectively avoid performance problems, such as cracking of the nylon nut, thereby effectively lengthening the overall service life of the equipment and the photovoltaic element containing this photovoltaic connector and greatly reducing energy consumption.

Abstract: Provided is a low-pressure chip packaging type junction box for a solar power generation assembly and a processing method thereof, and more particularly, relates to a low-pressure chip packaging type junction box for a solar power generation assembly integrating techniques relating to development and manufacturing of junction boxes with semiconductor packaging techniques to increase a degree of product automation and a processing method thereof. The low-pressure chip packaging type junction box for a solar power generation assembly comprises a box body, N chips, N connection members, and N+1 copper conductors, where N?1. At least one accommodation recess is arranged at the box body. The box body is provided with a transverse bar. Chip installation positions are arranged at N copper conductors. The N+1 copper conductors are provided with lead-out positions positioned at a top surface of the transverse bar. The chip is welded and fixed to the installation position at the copper conductor.

Abstract: According to a first aspect, in a time period after a line card switchover, a CMTS router makes each ranging opportunity in a bandwidth allocation map effectively wider by padding mute areas, which no modem can use, before and after a ranging opportunity. This is to keep a ranging packet of one modem from colliding with transmissions from other modems that may have incorrect timing offset after a switchover. According to a second aspect, the CMTS router sends a modem affected by a switchover one or more unsolicited requests to adjust its timing offset in an effort to keep the modem from going offline.

Abstract: According to a first aspect, in a time period after a line card switchover, a CMTS router makes each ranging opportunity in a bandwidth allocation map effectively wider by padding mute areas, which no modem can use, before and after a ranging opportunity. This is to keep a ranging packet of one modem from colliding with transmissions from other modems that may have incorrect timing offset after a switchover. According to a second aspect, the CMTS router sends a modem affected by a switchover one or more unsolicited requests to adjust its timing offset in an effort to keep the modem from going offline.