Abstract: The technology of this disclosure relates to a connection assembly, a board-level architecture, and a computing device. The connection assembly is configured to connect a semiconductor wafer and a lower layer substrate that are disposed opposite to each other, and includes an insulator structure and a plurality of connection terminals that are disposed at spacings. A first end and a second end of any one of the plurality of connection terminals each are provided with a welding structure. The first end is welded to the semiconductor wafer, and the second end is welded to the lower layer substrate. The insulator structure includes a plurality of empty slots provided at spacings. Positions of the plurality of empty slots are in a one-to-one correspondence with positions of the plurality of connection terminals. Any one of the plurality of connection terminals is disposed in any empty slot, to fasten a position of the connection terminal.

Abstract: The technology of this disclosure relates to a stacked structure, a display screen, and a display apparatus. The stacked structure includes a substrate, a drive chip, and a pixel unit that are stacked. The substrate has a first surface. A line layer is disposed on the first surface, the drive chip is disposed on a surface that is of the line layer and that faces away from the first surface, and the pixel unit and a corresponding drive chip are stacked. A sub-pixel located in each pixel unit is separately electrically connected to the line layer and the corresponding drive chip to form a light-emitting loop.

Abstract: The technology of this disclosure relates to a connection assembly, a board-level architecture, and a computing device. The connection assembly is configured to connect a semiconductor wafer and a lower layer substrate that are disposed opposite to each other, and includes an insulator structure and a plurality of connection terminals that are disposed at spacings. A first end and a second end of any one of the plurality of connection terminals each are provided with a welding structure. The first end is welded to the semiconductor wafer, and the second end is welded to the lower layer substrate. The insulator structure includes a plurality of empty slots provided at spacings. Positions of the plurality of empty slots are in a one-to-one correspondence with positions of the plurality of connection terminals. Any one of the plurality of connection terminals is disposed in any empty slot, to fasten a position of the connection terminal.

Abstract: A display screen, a terminal, and a backlight system, where the backlight system includes a substrate, a plurality of spot light sources, an optical conversion layer, and a light mixing member, where the spot light sources are fastened onto the substrate in a mutually spaced manner. The optical conversion layer is stacked on the substrate and covers the spot light sources. The optical conversion layer is configured to convert, into a white surface light source, light emitted by the spot light sources. The light mixing member is located on a surface of the optical conversion layer or embedded into the optical conversion layer. The light mixing member is configured to mix the light. The backlight system emits light evenly and has a relatively small thickness.

Abstract: A display screen, a terminal, and a backlight system, where the backlight system includes a substrate, a plurality of spot light sources, an optical conversion layer, and a light mixing member, where the spot light sources are fastened onto the substrate in a mutually spaced manner. The optical conversion layer is stacked on the substrate and covers the spot light sources. The optical conversion layer is configured to convert, into a white surface light source, light emitted by the spot light sources. The light mixing member is located on a surface of the optical conversion layer or embedded into the optical conversion layer. The light mixing member is configured to mix the light. The backlight system emits light evenly and has a relatively small thickness.

Abstract: A board-level architecture is provided. The board-level architecture includes: a first circuit board, a system-in-a-package module, at least one conductive terminal, and at least one first component. The system-in-a-package module is fastened on an upper surface of the first circuit board. The conductive terminal is located between a lower surface of the system-in-a-package module and the upper surface of the first circuit board, and the conductive terminal is separately electrically connected to the system-in-a-package module and the first circuit board. The first component is fastened on the upper surface of the first circuit board, and the first component is located in a region between the lower surface of the system-in-a-package module and the upper surface of the first circuit board.