Patents by Inventor Daqing Peng

Daqing Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240364013
    Abstract: A transfer structure includes a circuit board that includes a first metal layer, a second metal layer, and a dielectric layer. The dielectric layer is located between the first metal layer and the second metal layer. The first metal layer includes a radiation portion and a microstrip that is coupled to one end of the radiation portion. The second metal layer is grounded. The radiation portion is provided with an opening to enable the radiation portion to form at least two resonance frequencies such that the operating bandwidth of the transfer structure can be extended.
    Type: Application
    Filed: June 28, 2024
    Publication date: October 31, 2024
    Inventors: Yin He, Zhongshan Tang, Chen Gao, Daqing Peng, Xiaopan Yang
  • Publication number: 20220171018
    Abstract: Embodiments provide a radio frequency apparatus including a radome, an absorber, and a radio frequency circuit board that may be used for millimeter wave radar of an intelligent automobile to reduce high-frequency radiation interference from a radio frequency chip and an antenna feeder.
    Type: Application
    Filed: February 15, 2022
    Publication date: June 2, 2022
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhe Cheng, Daqing Peng, Zhiwei Zhang, Jie Peng, Bin Hu, Lungang Yun