Abstract: An equipment platform system and a wafer transfer method used to a wafer processing is provided. The equipment platform system comprises: a working platform, each side of the working platform is used to mount process chamber; a top-loading wafer device fixed on the top surface of working platform, the top-loading wafer device includes: a cassette or FOUP loading unit, a wafer loading unit installed disposed opposite the cassette or FOUP loading unit, the wafer loading unit has an inside cavity; a central robot, located between the cassette or FOUP loading unit and the wafer loading unit; a loading gate used to open or close the inside cavity; a wafer tray, which is in the inside cavity; a shutoff gate, which is at the bottom of the inside cavity, used to open or close the internal of the working platform; there is an opening at the top of the working platform, the opening is located at the lower part of the inside cavity, and disposed opposite the shutoff gate, the shutoff gate can seal the opening.

Abstract: An equipment platform system and a wafer transfer method used to a wafer processing is provided. The equipment platform system comprises: a working platform, each side of the working platform is used to mount process chamber; a top-loading wafer device fixed on the top surface of working platform, the top-loading wafer device includes: a cassette or FOUP loading unit, a wafer loading unit installed disposed opposite the cassette or FOUP loading unit, the wafer loading unit has an inside cavity; a central robot, located between the cassette or FOUP loading unit and the wafer loading unit; a loading gate used to open or close the inside cavity; a wafer tray, which is in the inside cavity; a shutoff gate, which is at the bottom of the inside cavity, used to open or close the internal of the working platform; there is an opening at the top of the working platform, the opening is located at the lower part of the inside cavity, and disposed opposite the shutoff gate, the shutoff gate can seal the opening.