Abstract: A semi-finished product of a power device including a semiconductor chip and a first solder pad is provided. The semiconductor chip has an active surface and a rear surface opposite to the active surface. The first solder pad is positioned and fixed on a center of the semiconductor chip. The first solder pad is sheet-shaped. The semiconductor chip is connected to the first solder pad with the active surface. A size of the first solder pad is smaller than a size of the semiconductor chip to expose a portion of the semiconductor chip. A manufacturing method of the semi-finished product of the power device and a manufacturing method of the power device are also provided.

Abstract: A method for manufacturing a power diode including the following steps is provided. (a) A semi-finished product of the power diode is provided. The semi-finished product of the power diode includes a first electrode, a second electrode, a semiconductor chip, and an adhesive material. The semiconductor chip is located between the first electrode and the second electrode. The adhesive material is located on the first electrode and surrounds the semiconductor chip. (b) The semi-finished product of the power diode is placed into a processing chamber. (c) Pressure in the processing chamber is adjusted to a first predetermined pressure and the first predetermined pressure is maintained for a predetermined time. (d) Pressure in the processing chamber is adjusted to a second predetermined pressure. Step (c) to Step (d) are performed at least twice to form the power diode. (e) The power diode is removed from the processing chamber.

Abstract: The present invention relates to optical components for reversing and inverting images, and to methods of manufacturing them accurately, robustly and cost-effectively. The method includes optical contact bonding a first optical element and a second optical element and adhesively bonding the first optical element and the second optical element. Adhesively bonding might include forming a notch into the second optical element and depositing a bead of adhesive into the notch, such that the adhesive adheres to both the notch and the first optical element.

Abstract: An optical imaging system comprises an input optical system, which collects light from a scene and directs the light onto an input optical path. The optical imaging system also comprises a beam splitter, which is moveable to a beam-splitting position where the beam splitter intercepts the light on the input optical path and a non-beam-splitting position where the beam splitter is located outside of the input optical path. The beam splitter comprises a body penetrated by an aperture and a reflective surface surrounding the aperture. When the beam splitter is located in the beam-splitting position, a portion of the light in the optical path is transmitted through the aperture and a portion of the light in the optical path is reflected from the reflective surface. Both the reflected portion of the light and the transmitted portion of the light are capable of reproducing images of the scene at their respective focal points.