Abstract: The disclosure relates to a computer implemented method and component configured to assess the value of goods and services provided by a vendor to a service agency. An embodiment of the method includes the act of storing, in an electronic database, a total-budget value, an amount-paid value, a case-score value, a total-case-score value, a vendor-service-score value, and a total-vendor-services-score value. The embodiment includes selecting a vendor, forming a vendor-score-contribution value, distributing the case value of one or more service items provided by the vendor, and computing the net contribution of the vendor.

Abstract: The disclosure relates to a computer implemented method and component configured to assess the value of goods and services provided by a vendor to a service agency. An embodiment of the method includes the act of storing, in an electronic database, a total-budget value, an amount-paid value, a case-score value, a total-case-score value, a vendor-service-score value, and a total-vendor-services-score value. The embodiment includes selecting a vendor, forming a vendor-score-contribution value, distributing the case value of one or more service items provided by the vendor, and computing the net contribution of the vendor.

Abstract: The disclosure relates to a computer implemented method and component configured to assess the value of goods and services provided by a vendor to a service agency. An embodiment of the method includes the act of storing, in an electronic database, a total-budget value, an amount-paid value, a case-score value, a total-case-score value, a vendor-service-score value, and a total-vendor-services-score value. The embodiment includes selecting a vendor, forming a vendor-score-contribution value, distributing the case value of one or more service items provided by the vendor, and computing the net contribution of the vendor.

Abstract: Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps and thereby prevents oxidation of the bumps between die prep and chip and attach. In an alternative embodiment, an ultraviolet light absorber is added to the wafer coat formulation to enhance the wafer coat layer's energy absorption and thereby improve the laser's ability to ablate the wafer coat layer. In an alternative embodiment, a conformal wafer coat layer is deposited on the wafer and die bumps, thereby reducing wafer coat layer thickness variations that can impact the laser scribing ability.

Abstract: Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps and thereby prevents oxidation of the bumps between die prep and chip and attach. In an alternative embodiment, an ultraviolet light absorber is added to the wafer coat formulation to enhance the wafer coat layer's energy absorption and thereby improve the laser's ability to ablate the wafer coat layer. In an alternative embodiment, a conformal wafer coat layer is deposited on the wafer and die bumps, thereby reducing wafer coat layer thickness variations that can impact the laser scribing ability.

Abstract: Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps and thereby prevents oxidation of the bumps between die prep and chip and attach. In an alternative embodiment, an ultraviolet light absorber is added to the wafer coat formulation to enhance the wafer coat layer's energy absorption and thereby improve the laser's ability to ablate the wafer coat layer. In an alternative embodiment, a conformal wafer coat layer is deposited on the wafer and die bumps, thereby reducing wafer coat layer thickness variations that can impact the laser scribing ability.

Abstract: Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps and thereby prevents oxidation of the bumps between die prep and chip and attach. In an alternative embodiment, an ultraviolet light absorber is added to the wafer coat formulation to enhance the wafer coat layer's energy absorption and thereby improve the laser's ability to ablate the wafer coat layer. In an alternative embodiment, a conformal wafer coat layer is deposited on the wafer and die bumps, thereby reducing wafer coat layer thickness variations that can impact the laser scribing ability.