Patents by Inventor Daren L. FORREST

Daren L. FORREST has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRICAL CONNECTORS
    Publication number: 20220396077
    Abstract: Examples of electrical connectors are provided herein. In some examples, an electrical connector includes a contact pad at a first end of a route. In some examples, the electrical connector includes a bond at a second end of the route. In some examples, the contact pad and the bond include a copper layer on a substrate, a nickel layer on the copper layer, and a gold layer on the nickel layer. In some examples, the gold layer has a first thickness on the contact pad and has a second thickness on the bond. In some examples, the second thickness is greater than the first thickness.
    Type: Application
    Filed: October 25, 2019
    Publication date: December 15, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Paul David Schweitzer, Max Richard Quinn, Daren L. Forrest, Thomas Stafford Johnson
  • Fluid ejection devices including electrical interconnect elements for fluid ejection dies
    Patent number: 11472180
    Abstract: A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: October 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony M. Fuller, Daren L. Forrest, Michael W. Cumbie, Michael Groom, Conrad Jenssen
  • FLUID EJECTION DEVICES INCLUDING ELECTRICAL INTERCONNECT ELEMENTS FOR FLUID EJECTION DIES
    Publication number: 20210260872
    Abstract: A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.
    Type: Application
    Filed: February 6, 2019
    Publication date: August 26, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Anthony M. FULLER, Daren L. FORREST, Michael W. CUMBIE, Michael GROOM, Conrad JENSSEN