Abstract: An optical assembly includes a substrate with a first row of apertures and a second row of apertures. A first optical die includes a first plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each transducer element is aligned with an aperture of the first row of optical apertures. A second optical die includes a second plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each of the second plurality of optical transducer elements is aligned with an aperture of the second row of optical apertures. A connector configured to mate with the optical assembly supports a plurality of optical fibers. A terminal end of each optical fiber protrudes from the connector and extends into one of the apertures when the connector is coupled with the optical assembly.

Abstract: An optical assembly includes a substrate with a first row of apertures and a second row of apertures. A first optical die includes a first plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each transducer element is aligned with an aperture of the first row of optical apertures. A second optical die includes a second plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each of the second plurality of optical transducer elements is aligned with an aperture of the second row of optical apertures. A connector configured to mate with the optical assembly supports a plurality of optical fibers. A terminal end of each optical fiber protrudes from the connector and extends into one of the apertures when the connector is coupled with the optical assembly.

Abstract: An optical assembly (10) includes a rigid mount (12) with a recess (26) proximate a first side thereof, a substrate (14), and an optical die (16) flip-chip bonded to the substrate (14). The substrate (14) is secured to the first side of the mount and includes a plurality of die bonding elements (40), a plurality of optical apertures (32), and a plurality of external bonding elements (42). A plurality of traces (44) interconnect the die bonding elements (40) and the external bonding elements (42). The optical die (16) includes a plurality of optical elements, each element including an optical signal interface (48), the die being bonded to the plurality of die bonding elements (40) such that the optical signal interface (48) of each element is in registry with an optical aperture (32) of the substrate (14) and the die (16) is at least partially enclosed by the recess (26).

Abstract: An optical assembly (10) includes a rigid mount (12) with a recess (26) proximate a first side thereof, a substrate (14), and an optical die (16) flip-chip bonded to the substrate (14). The substrate (14) is secured to the first side of the mount and includes a plurality of die bonding elements (40), a plurality of optical apertures (32), and a plurality of external bonding elements (42). A plurality of traces (44) interconnect the die bonding elements (40) and the external bonding elements (42). The optical die (16) includes a plurality of optical elements, each element including an optical signal interface (48), the die being bonded to the plurality of die bonding elements (40) such that the optical signal interface (48) of each element is in registry with an optical aperture (32) of the substrate (14) and the die (16) is at least partially enclosed by the recess (26).