Abstract: A test chamber that is capable of operating in a mode where the temperature of the chamber is efficiently cooled without removing a substantial amount of moisture from the air. In one aspect, the test chamber includes a structure defining a work space having air, and a temperature control system (e.g., a refrigeration system having a compressor, a condenser, and an evaporator valve). The temperature control system includes a heat exchanger (e.g., an evaporator) positioned to communicate with the air in the work space, a source of cold fluid (e.g., a compressed, condensed, and throttled refrigerant) coupled to the heat exchanger, a source of hot fluid (e.g., compressed refrigerant gas) coupled to the heat exchanger, and a controller for controlling a mixture of cold fluid and hot fluid entering the heat exchanger (e.g., by adjusting a cold fluid valve and/or a hot fluid valve).

Abstract: A thermal cycling system includes a structure defining a load space, a heating assembly positioned to heat to the load space, and a cooling assembly positioned to cool the load space. The cooling assembly includes a refrigeration circuit and a banking circuit. The refrigeration circuit has a compressor, a refrigeration condenser, a first refrigeration evaporator in direct thermal communication with the load space, a second refrigeration evaporator in parallel with the first evaporator, and primary refrigerant circulating throughout the refrigeration circuit. The banking circuit is gravity fed and includes a banking condenser, a banking evaporator positioned to cool the load space, and a banking refrigerant circulating throughout the banking circuit. The banking condenser includes a collection reservoir to store liquid banking refrigerant and is in thermal communication with the second refrigeration evaporator.

Abstract: A thermal cycling system includes a structure defining a load space, a heating assembly positioned to heat to the load space, and a cooling assembly positioned to cool the load space. The cooling assembly includes a refrigeration circuit and a banking circuit. The refrigeration circuit has a compressor, a refrigeration condenser, a first refrigeration evaporator in direct thermal communication with the load space, a second refrigeration evaporator in parallel with the first evaporator, and primary refrigerant circulating throughout the refrigeration circuit. The banking circuit is gravity fed and includes a banking condenser, a banking evaporator positioned to cool the load space, and a banking refrigerant circulating throughout the banking circuit. The banking condenser includes a collection reservoir to store liquid banking refrigerant and is in thermal communication with the second refrigeration evaporator.

Abstract: A test chamber that is capable of operating in a mode where the temperature of the chamber is efficiently cooled without removing a substantial amount of moisture from the air. In one aspect, the test chamber includes a structure defining a work space having air, and a temperature control system (e.g., a refrigeration system having a compressor, a condenser, and an evaporator valve). The temperature control system includes a heat exchanger (e.g., an evaporator) positioned to communicate with the air in the work space, a source of cold fluid (e.g., a compressed, condensed, and throttled refrigerant) coupled to the heat exchanger, a source of hot fluid (e.g., compressed refrigerant gas) coupled to the heat exchanger, and a controller for controlling a mixture of cold fluid and hot fluid entering the heat exchanger (e.g., by adjusting a cold fluid valve and/or a hot fluid valve).

Abstract: A carrier of circuit boards includes a base frame having a plurality of first card guides disposed on its upper surface, the first card guides for securing respective first side edges of a corresponding plurality of circuit boards, a plurality of second card guides for securing respective second side edges of the plurality of circuit boards, and a plurality of adjustment members, each being for individually adjusting a distance between a respective pair of one first card guide and one second card guide. A method of preparing a carrying arrangement for a plurality of circuit boards includes providing a carrier for the plurality of circuit boards. Groups of circuit boards having different vertical on-edge dimensions may be interconnected and/or tested by being placed together and individually snugly held on a single carrier shelf.