Patents by Inventor Darin Grinsteinner

Darin Grinsteinner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11931973
    Abstract: A fiber-reinforced polymer composition that comprises a polymer matrix that contains a propylene polymer is provided. The polymer matrix constitutes from about 20 wt. % to about 90 wt. % of the composition, and the composition further comprises a plurality of long reinforcing fibers that are distributed within the polymer matrix, wherein the fibers constitute from about 10 wt. % to about 60 wt. % of the composition. Further, the composition also comprises a stabilizer system comprising a sterically hindered phenol antioxidant, phosphite antioxidant, and thioester antioxidant.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: March 19, 2024
    Assignee: Ticona LLC
    Inventors: Aaron H. Johnson, Darin Grinsteinner
  • Publication number: 20230203271
    Abstract: A polymer composition containing a thermoplastic polymer and an electromagnetic interference filler is provided. At a thickness of 3.2 millimeters and over a frequency range from 2 GHz to 18 GHz, the composition may exhibit an average absorbency of about 25% or greater and an average electromagnetic interference shielding effectiveness of about 40 decibels or more, as determined in accordance with ASTM D4935-18.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 29, 2023
    Inventors: Yuehua Yu, Joseph Grenci, Brian Hokkanen, Darin Grinsteinner, Jun Luo, Prabuddha Bansal
  • Patent number: 11555113
    Abstract: A polymer composition is disclosed that comprises a polymer matrix containing at least one thermotropic liquid crystalline polymer and at least one hollow inorganic filler having a dielectric constant of about 3.0 or less at a frequency of 100 MHz wherein the weight ratio of the at least one thermotropic liquid crystalline polymer to the at least one hollow inorganic filler is from about 0.1 to about 10 and wherein the polymer composition exhibits a dielectric constant of about 4 or less and a dissipation factor of about 0.02 or less, as determined at a frequency of 10 GHz.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: January 17, 2023
    Assignee: Ticona LLC
    Inventors: Young Shin Kim, Darin Grinsteinner
  • Publication number: 20220356341
    Abstract: A polymer composition containing a polyoxymethylene polymer in the form of particles for rotational molding applications is disclosed. The polyoxymethylene polymer is selected to have physical characteristics and is combined with one or more impact modifiers in order to produce hollow vessels and other articles having improved physical properties, such as impact strength resistance.
    Type: Application
    Filed: April 15, 2022
    Publication date: November 10, 2022
    Inventor: Darin Grinsteinner
  • Patent number: 11466130
    Abstract: A fiber-reinforced polymer composition that comprises a polymer matrix; a thermally conductive filler distributed within the polymer matrix; and a plurality of long fibers distributed within the polymer matrix is provided. The long fibers comprise an electrically conductive material and have a length of about 7 millimeters or more. Further, the composition exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: October 11, 2022
    Assignee: Ticona LLC
    Inventor: Darin Grinsteinner
  • Publication number: 20210309851
    Abstract: A binder composition containing a polyoxymethylene polymer combined with one or more plasticizers is disclosed that is well suited for use in powder injection molding processes. The binder composition can be combined with inorganic sinterable particles and melt blended together to form a feedstock. The feedstock can be fed through an injection molding process to form a green body. The binder composition of the present disclosure can be easily removed from the green body by contacting the green body with one or more acids. The resulting brown body can then be fed through a sintering process for producing three-dimensional articles having complex shapes.
    Type: Application
    Filed: February 12, 2021
    Publication date: October 7, 2021
    Inventors: Xiaowei Zhang, Sung Hye Kim, Christopher McGrady, Xinyu Zhao, Darin Grinsteinner
  • Patent number: 11129312
    Abstract: An electronic module that comprises a housing; a cover that is disposed over the housing to define an interior; and one or more electronic components positioned within the interior is provided. At least a portion of the housing, cover, or both contain a polymer composition that exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: September 21, 2021
    Assignee: Ticona LLC
    Inventor: Darin Grinsteinner
  • Publication number: 20210070983
    Abstract: A polymer composition is disclosed that comprises a polymer matrix containing at least one thermotropic liquid crystalline polymer and at least one hollow inorganic filler having a dielectric constant of about 3.0 or less at a frequency of 100 MHz wherein the weight ratio of the at least one thermotropic liquid crystalline polymer to the at least one hollow inorganic filler is from about 0.1 to about 10 and wherein the polymer composition exhibits a dielectric constant of about 4 or less and a dissipation factor of about 0.02 or less, as determined at a frequency of 10 GHz.
    Type: Application
    Filed: August 18, 2020
    Publication date: March 11, 2021
    Inventors: Young Shin Kim, Darin Grinsteinner
  • Publication number: 20210015457
    Abstract: An ultrasonic probe that comprises an ultrasonic transducer that includes an array of transducer elements and an attenuation material is provided. The attenuation material comprises a polymer composition that includes a liquid crystalline polymer and a thermally conductive particulate material. The liquid crystalline polymer has a melting temperature of about 270° C. or more and a melt viscosity of about 500 Pa-s or less as determined at a temperature of 45° C. above the melting temperature and shear rate of 400 s?1 in accordance with ISO Test No. 11443:2005, and the polymer composition also has a through-plane conductivity of about 0.2 W/m-K or more.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 21, 2021
    Inventors: Darin Grinsteinner, Young Shin Kim
  • Publication number: 20190270260
    Abstract: A fiber-reinforced polymer composition that comprises a polymer matrix that contains a propylene polymer is provided. The polymer matrix constitutes from about 20 wt. % to about 90 wt. % of the composition, and the composition further comprises a plurality of long reinforcing fibers that are distributed within the polymer matrix, wherein the fibers constitute from about 10 wt. % to about 60 wt. % of the composition. Further, the composition also comprises a stabilizer system comprising a sterically hindered phenol antioxidant, phosphite antioxidant, and thioester antioxidant.
    Type: Application
    Filed: February 19, 2019
    Publication date: September 5, 2019
    Inventors: Aaron H. Johnson, Darin Grinsteinner
  • Publication number: 20190153179
    Abstract: A fiber-reinforced polymer composition that comprises a polymer matrix; a thermally conductive filler distributed within the polymer matrix; and a plurality of long fibers distributed within the polymer matrix is provided. The long fibers comprise an electrically conductive material and have a length of about 7 millimeters or more. Further, the composition exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.
    Type: Application
    Filed: November 14, 2018
    Publication date: May 23, 2019
    Inventor: Darin Grinsteinner
  • Publication number: 20190159371
    Abstract: An electronic module that comprises a housing; a cover that is disposed over the housing to define an interior; and one or more electronic components positioned within the interior is provided. At least a portion of the housing, cover, or both contain a polymer composition that exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.
    Type: Application
    Filed: November 14, 2018
    Publication date: May 23, 2019
    Inventor: Darin Grinsteinner