Abstract: A vehicular slider window assembly includes a movable window panel that is movable along rails at an opening of a fixed window panel. A perimeter seal is disposed at a surface of the fixed window panel and circumscribes the opening and is configured to seal against a surface of the movable window panel when the movable window panel is in a closed position. The perimeter seal includes elongated sealing portions joined at respective corner regions, with adjacent end regions of attachment elements of the sealing portions being spaced from one another at the respective corner regions such that there is a gap between the adjacent end regions. With the attachment elements attached at the surface of the fixed window panel, a sealant is dispensed into the gaps via passageways to seal the corner regions of the perimeter seal at the fixed window panel.

Abstract: A transistor outline package having a feedthrough via and lead configuration that maximizes the amount of usable area on a header of the package is disclosed. In one embodiment, the package includes a header having an interior surface that includes a first and second lead assembly. The first lead assembly includes two vias having a first diameter, with each first via being positioned along a first pin circle imaginarily defined on the interior surface of the header. Each first via also includes first leads received therein. The second lead assembly includes four vias having a second diameter each, with each second via being positioned along a second pin circle that has a diameter greater than that of the first pin circle. Each second via includes second leads received therein. This configuration increases usable area on the header interior surface between the leads, enabling relatively larger submounts to be placed thereon.

Abstract: An optical transmission system includes more optical channels than electrical channels. If an optical channel is not functioning, the signals may be diverted to another optical channel since there are more optical channels than electrical channels. Embodiments of the present invention also relate to switches for switching the electrical channels to particular optical channels on either or both of the transmission and reception side. The switches include switching elements and selector elements for routing the electrical signals between the electrical channels and optical channels. In one embodiment, the multiple optical channels are incorporated into a single cable. The single cable may have the electrical interface for a number of electrical channels exposed for mechanical and electrical coupling with an external port, whereas the optical channels may be hidden within the cable coating.

Abstract: A translation circuit for mediating between a fiber-optic controller chip and a host device. The translation circuit may be on a fiber-optic transponder. The controller chip includes a phase locked loop that outputs a short synchronization signal when a hunting frequency passes through a target data signal frequency while hunting for a data signal and outputs a synchronization signal when the phase locked loop is locked onto a data signal. The translation circuit distinguishes between the synchronization signals and generates a lock signal when the phase locked loop is locked onto a data signal, but does not when the hunting frequency passes through the target data signal frequency. The lock signal may be used by a host device into which the fiber-optic transponder has been in installed. Errors from misinterpreted signals can thus be mitigated.

Abstract: An active cable that is configured to communicate over much of its length using one or more optical fibers, and that includes an integrated electrical connector at at least one end. The active cable includes a power transmission spanning the length of the optical fiber(s). Thus, electrical power from one end of the optical cable may be provided to an opposite side of the optical cable. The cable may be an electrical to optical cable, and electrical to electrical cable, or one of many other potential configurations.

Abstract: An electrical connector that is integrated within an active cable at one end of the active cable, wherein the active cable is configured to communicate over much of its length using one or more optical fibers. The cable may be an electrical to optical cable, and electrical to electrical cable, or one of many other potential configurations.

Abstract: An active cable that is configured to communicate over much of its length using one or more optical fibers, and that includes an integrated electrical connector at least one end. The active cable includes an integrated retiming mechanism. Thus, multiple links of cable may be used while reducing the chance that the jitter will exceed allowable limits. The cable may be an electrical to optical cable, and electrical to electrical cable, or one of many other potential configurations.

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

Abstract: An optical transmission system includes more optical channels than electrical channels. If an optical channel is not functioning, the signals may be diverted to another optical channel since there are more optical channels than electrical channels. Embodiments of the present invention also relate to switches for switching the electrical channels to particular optical channels on either or both of the transmission and reception side. The switches include switching elements and selector elements for routing the electrical signals between the electrical channels and optical channels. In one embodiment, the multiple optical channels are incorporated into a single cable. The single cable may have the electrical interface for a number of electrical channels exposed for mechanical and electrical coupling with an external port, whereas the optical channels may be hidden within the cable coating.

Abstract: An active cable that communicates over much of its length using one or more optical fibers, but which includes at integrated electrical connector at least one of its ends. The cable may be an electrical to optical cable, and electrical to electrical cable, or one of many other potential configurations.

Abstract: In one example configuration, an optical package includes a substrate that supports a laser. The laser is configured for electrical communication with circuitry disposed on the substrate, and the laser is arranged to emit an optical signal along a first path. The optical package also includes a beam steering device supported by the substrate and arranged so as to receive the optical signal from the laser along the first path. The beam steering device is configured such that the optical signal is output from the beam steering device along a second path. A group of electronic leads is provided that electronically communicates with the circuitry on the substrate. In this example, the group includes a set of modulation leads in electrical communication with the laser, and a set of bias leads in electrical communication with the laser. The set of bias leads is electrically isolated from the set of modulation leads.

Abstract: A transistor outline package having a feedthrough via and lead configuration that maximizes the amount of usable area on a header of the package is disclosed. In one embodiment, the package includes a header having an interior surface that includes a first and second lead assembly. The first lead assembly includes two vias having a first diameter, with each first via being positioned along a first pin circle imaginarily defined on the interior surface of the header. Each first via also includes first leads received therein. The second lead assembly includes four vias having a second diameter each, with each second via being positioned along a second pin circle that has a diameter greater than that of the first pin circle. Each second via includes second leads received therein. This configuration increases usable area on the header interior surface between the leads, enabling relatively larger submounts to be placed thereon.

Abstract: An optoelectronic transceiver comprises an active linear TOSA circuit mounted on a header. The active linear TOSA circuit includes input nodes for receiving a differential signal pair, a first bipolar transistor, a second bipolar transistor and an electro-optical transducer. A base terminal of the first bipolar transistor is coupled to the two input nodes and an emitter terminal of the first bipolar transistor is coupled to a base terminal of the second bipolar transistor. A collector terminal of the first bipolar transistor is coupled to a first terminal of the electro-optical transducer, the first terminal of the electro-optical transducer also being configured to be coupled to a voltage source. A collector terminal of the second bipolar transistor is coupled to a second terminal of the electro-optical transducer and an emitter terminal of the second bipolar transistor is coupled to a signal ground which is not the header ground.

Abstract: An active linear amplifier circuit mounted in an optoelectronic package includes input nodes for receiving a differential signal pair, a first bipolar transistor, a second bipolar transistor, an electro-optical transducer and a decoupling circuit. A base terminal of the first bipolar transistor is coupled to the two input nodes and an emitter terminal of the first bipolar transistor is coupled to a base terminal of the second bipolar transistor. A collector terminal of the first bipolar transistor is coupled to a first terminal of the electro-optical transducer, the first terminal of the electro-optical transducer also being configured to be coupled to a voltage source. A collector terminal of the second bipolar transistor is coupled to a second terminal of the electro-optical transducer and an emitter terminal of the second bipolar transistor is coupled to a signal ground which is not the header ground.

Abstract: In one example configuration, an optical package includes a substrate that supports a laser. The laser is configured for electrical communication with circuitry disposed on the substrate, and the laser is arranged to emit an optical signal along a first path. The optical package also includes a beam steering device supported by the substrate and arranged so as to receive the optical signal from the laser along the first path. The beam steering device is configured such that the optical signal is output from the beam steering device along a second path. A group of electronic leads is provided that electronically communicates with the circuitry on the substrate. In this example, the group includes a set of modulation leads in electrical communication with the laser, and a set of bias leads in electrical communication with the laser. The set of bias leads is electrically isolated from the set of modulation leads.

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

Abstract: An avalanche photodiode with a wide dynamic range. An avalanche photodiode with a wide dynamic range is used in fiber-optic communication applications where optical signals of varying powers may be received. The avalanche photodiode includes a field control layer. A doping thickness product can be configured to determine a dynamic range of the avalanche photodiode. The gain of the avalanche photodiode is controllable by adjusting a bias voltage across the avalanche photodiode.

Abstract: A boost converter for use in a transceiver. The boost converter includes an inductor that is connected to a power supply. A switch is coupled to the inductor and to the return of the power supply when the switch is closed. A diode is coupled to the inductor. A capacitor is coupled between the diode and the return of the power supply with an output voltage being present across the power supply. A microprocessor is coupled to the output voltage. The microprocessor produces a pulse width modulated signal in response to the output voltage. The pulse width modulated signal is coupled through a gate to a pulse train to produce a modulated pulse train. The modulated pulse train is used to control the switch. The modulated pulse train turns the switch on and off in a manner that drives the output voltage to a particular voltage.

Abstract: A translation circuit for mediating between a fiber-optic controller chip and a host device. The translation circuit may be on a fiber-optic transponder. The controller chip includes a phase locked loop that outputs a short synchronization signal when a hunting frequency passes through a target data signal frequency while hunting for a data signal and outputs a synchronization signal when the phase locked loop is locked onto a data signal. The translation circuit distinguishes between the synchronization signals and generates a lock signal when the phase locked loop is locked onto a data signal, but does not when the hunting frequency passes through the target data signal frequency. The lock signal may be used by a host device into which the fiber-optic transponder has been in installed. Errors from misinterpreted signals can thus be mitigated.