Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.

Abstract: Sensor interconnects and supports and methods of making them utilize phonon disruptors for increased thermal resistance while maintaining acceptable electrical signal quality in materials. Phonon disruptors include, but are not limited to, structural features such as interfaces, grain boundaries, and point scattering sites, for example, that are designed to scatter heat carriers while allowing electrons to pass through the material. Some embodiments herein involve designing selected stacks of alternating or sequential material pairs within sensor interconnects.

Abstract: Sensor interconnects and supports and methods of making them utilize phonon disruptors for increased thermal resistance while maintaining acceptable electrical signal quality in materials. Phonon disruptors include the use of an electrically conductive alloy material or intermetallic material of at least two or more elements to promote scattering of phonons. These materials are selected to scatter heat carriers while allowing electrons to pass through the material.

Abstract: A method of cooling includes providing an elastocaloric material; continuously applying a force on the elastocaloric material to cause a continuous mechanical deformation of the elastocaloric material for a predetermined period of time, such that the continuous mechanical deformation creates a solid-to-solid phase transformation in the elastocaloric material; emitting exothermic latent heat from the elastocaloric material to increase a temperature of the elastocaloric material; removing the force from the elastocaloric material upon expiration of the predetermined period of time; and absorbing endothermic latent heat into the elastocaloric material to decrease the temperature of the elastocaloric material and/or an environment adjacent to the elastocaloric material or an electronic/phononic device, etc.

Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.

Abstract: A scanning probe microscope includes a cantilever structure; and a metallization layer on the cantilever structure. The cantilever structure and the metallization layer expand and contract at equivalent rates upon thermal loading. The cantilever structure and the metallization layer may include matching coefficient of thermal expansion levels. The cantilever structure may include SiN. The metallization layer may include 50 nm of Ti. The metallization layer may include 50 nm of Cr. The metallization layer may include 5 nm of Ti and 45 nm of Ge. The cantilever structure may include no thermally-induced deflections.

Abstract: A scanning probe microscope includes a cantilever structure; and a metallization layer on the cantilever structure. The cantilever structure and the metallization layer expand and contract at equivalent rates upon thermal loading. The cantilever structure and the metallization layer may include matching coefficient of thermal expansion levels. The cantilever structure may include SiN. The metallization layer may include 50 nm of Ti. The metallization layer may include 50 nm of Cr. The metallization layer may include 5 nm of Ti and 45 nm of Ge. The cantilever structure may include no thermally-induced deflections.

Abstract: A heat exchange component includes a part configured for exchanging thermal energy, the part is formed of at least one solid state Martensitic transformation phase change material which is configured to readily undergo a solid-solid martensitic transformation from one crystalline structure to another different crystalline structure during a change in temperature in the normal and/or anticipated operating temperatures of the heat exchange component. In some embodiments, the system further includes a temporally-evolving external temperature/heat source which changes the temperature and resultant phase of the solid-state phase change material. The temporally-evolving external temperature/heat source may involve a solid conducting material or electronic/photonic component, a fluid, a plasma, and/or a radiation source.

Abstract: A method of cooling includes providing an elastocaloric material; continuously applying a force on the elastocaloric material to cause a continuous mechanical deformation of the elastocaloric material for a predetermined period of time, such that the continuous mechanical deformation creates a solid-to-solid phase transformation in the elastocaloric material; emitting exothermic latent heat from the elastocaloric material to increase a temperature of the elastocaloric material; removing the force from the elastocaloric material upon expiration of the predetermined period of time; and absorbing endothermic latent heat into the elastocaloric material to decrease the temperature of the elastocaloric material and/or an environment adjacent to the elastocaloric material or an electronic/phononic device, etc.